Lead Expert – Etch, Deposition, ALD & Metallization Metrology

Nearfield Instruments; Netherlands; On-site; EUR 120,000 - 180,000; Full time

Job summary

Nearfield Instruments seeks a senior semiconductor expert to lead metrology strategy for etching, ALD, deposition, and metallization. You will translate complex process challenges into clear metrology requirements and drive new applications, capabilities, and product features that create greater value for customers.

This role collaborates with leading fabs, R&D, and product teams to define measurements, roadmaps, and deployment strategies that improve yield and manufacturability in high‑volume

Qualifications

• Significant experience in semiconductor process integration, focusing on etch, deposition, ALD, and metallization.
• Deep understanding of metrology, inspection, and process control in high‑volume manufacturing.
• Experience collaborating with leading fabs, equipment suppliers, or R&D organizations.
• Proven ability to lead cross‑functional teams and translate complex process challenges into differentiated products.

Responsibilities

• Lead identification of metrology needs and critical process‑control gaps in etch, deposition, ALD, and metallization.
• Define valuable measurements, specs, and use cases (e.g., trench depth, sidewall profile, film conformality).
• Set priorities and translate customer/manufacturing needs into product and technology roadmaps.
• Engage with customers, process engineers, and equipment partners to validate requirements and accelerate adoption.
• Drive development of metrology solutions that improve process control, yield, and manufacturing performance.
• Guide R&D and product teams on measurement performance and workflow integration.

Skills

Semiconductor integration

Metrology

Cross-functional leadership

Etch

ALD

CVD

PVD

Job description

About Nearfield Instruments

Nearfield Instruments (NFI) is a fast‑growing, high‑tech scale‑up that designs, develops, integrates, markets, and services advanced metrology machines. Our solutions enable the world’s leading chipmakers to increase production yield and improve device performance—powering smaller, faster, and more energy‑efficient electronics.

Nearfield brings together leading experts in science and engineering to develop a unique, high‑throughput Scanning Probe Microscopy (SPM) platform delivering true 3D, sub‑nanometer resolution metrology at production scale.

Position Overview

We are looking for a senior semiconductor expert with deep experience in etching, thin‑film deposition, atomic layer deposition (ALD), and metallization, gained within a leading‑edge fab, research institute, or semiconductor equipment company. This expert will lead Nearfield Instruments’ application and technology direction for advanced patterning, thin‑film formation, conformal deposition, and metal integration. The role will identify the most critical process‑control challenges, translate them into clear metrology requirements, and drive the development of new applications, capabilities, and product features that create greater value for customers.

Key responsibilities

• Lead the identification of unmet metrology needs and critical process‑control gaps in etch, deposition, ALD, and metallization.
• Define the most valuable measurements, specifications, and use cases, including trench and via depth, sidewall profile, recess, footing, bowing, surface roughness, film conformality, step coverage, thickness uniformity, interface topography, and metal dishing or overburden.
• Set application priorities and translate customer and manufacturing needs into product and technology roadmaps.
• Lead engagement with customers, process engineers, and equipment partners to validate requirements and accelerate adoption.
• Drive the development of metrology solutions that improve process control, yield, chamber matching, qualification time, and manufacturing performance.
• Guide R&D and product teams on measurement performance, workflow integration, sampling strategies, and high‑volume manufacturing requirements.

Ideal candidate qualifications

• Significant experience in semiconductor process integration, dry or wet etch, CVD, PVD, ALD, electroplating, or metallization.
• Strong understanding of metrology, inspection, and process control in high‑volume manufacturing.
• Experience working with leading semiconductor fabs, equipment suppliers, or advanced R&D organizations.
• A proven ability to lead cross‑functional teams and convert complex process challenges into differentiated products and applications.