Wafer Equipment Technician: Sort & C4 Bump Modules (Penang)

Intel Corporation; Penang; On-site; MYR 60,000 - 100,000; Full time

Job summary

Intel Corporation in Penang seeks an engineer to troubleshoot wafer‑level semiconductor equipment and perform setup, calibration, and maintenance to ensure production readiness. The role involves data analysis, responding to alarms, and collaborating with Module Engineering to minimize downtime and improve reliability.

The ideal candidate holds a Diploma in Mechanical Engineering and has hands‑on experience with semiconductor equipment, SPC concepts, and maintenance procedures.

Qualifications

• Hands-on trouble shooting of wafer‑level equipment is expected.
• Familiar with maintenance, calibration, and recovery of equipment.
• Exposure to SPC, monitoring and data interpretation is preferred.

Responsibilities

• Troubleshoot electrical, mechanical, electronic, and/ or mechatronic issues on semiconductor equipment.
• Perform setup, calibration, preventive maintenance, repair and component replacement per procedures.
• Monitor equipment performance and analyze data to identify abnormalities and impacts on output.
• Respond to alarms and excursions per established procedures to minimize downtime.
• Collaborate with Module Engineering to restore equipment and support readiness.
• Create and maintain maintenance records and equipment failure reports for reliability.

Skills

Troubleshooting

Electrical systems

Mechatronics

Data analysis

SPC basics

Education

Diploma in Mechanical Engineering

Job description

Intel Corporation in Penang seeks an engineer to troubleshoot wafer‑level semiconductor equipment and perform setup, calibration, and maintenance to ensure production readiness. The role involves data analysis, responding to alarms, and collaborating with Module Engineering to minimize downtime and improve reliability.

The ideal candidate holds a Diploma in Mechanical Engineering and has hands‑on experience with semiconductor equipment, SPC concepts, and maintenance procedures.