Tooling & Equipment Engineer (Fresh Graduate)

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 36,000 - 60,000; Full time

Job summary

Carsem (M) Sdn. Bhd in Ipoh, Malaysia is seeking a Mechanical/Electrical/Mechatronic Engineer to support trim and form tooling, perform preventive maintenance, and monitor tool life. You will develop 3D models and drawings, and collaborate with technicians and production teams to resolve tooling issues.

The role welcomes fresh graduates and requires knowledge of CAD software (AutoCAD/SolidWorks). You will work in a fast-paced manufacturing environment and participate in process improvements to

Qualifications

• Bachelor's degree in mechanical, Electrical/Electronic, Mechatronic Engineering or related field.
• Fresh graduates are encouraged to apply.
• Knowledge of equipment maintenance and troubleshooting.
• Ability to interpret electrical circuit diagrams and engineering drawings.
• Familiarity with AutoCAD, SolidWorks or other 3D CAD software.
• Strong analytical and problem-solving skills.
• Good communication and teamwork abilities.
• Willing to work in a fast-paced manufacturing environment.

Responsibilities

• Support trim and form tooling activities to ensure smooth production operations.
• Perform preventive maintenance and troubleshooting on tooling and equipment.
• Monitor tooling performance and tool life control.
• Assist in tooling improvement, modification, and new product expansion activities.
• Develop and maintain 3D models and engineering drawings using CAD software.
• Work closely with technicians and production teams to resolve tooling-related issues.
• Participate in continuous improvement projects to improve productivity, quality, and equipment reliability.

Skills

Analytical skills

Problem solving

Communication

Teamwork

Education

Bachelor's degree in mechanical, Electrical/Electronic, Mechatronic Engineering

Tools

AutoCAD

SolidWorks

Job description

Support trim and form tooling activities to ensure smooth production operations.

Perform preventive maintenance and troubleshooting on tooling and equipment.

Monitor tooling performance and tool life control.

Assist in tooling improvement, modification, and new product expansion activities.

Develop and maintain 3D models and engineering drawings using CAD software.

Work closely with technicians and production teams to resolve tooling-related issues.

Participate in continuous improvement projects to improve productivity, quality, and equipment reliability.

Requirements

Bachelor's degree in mechanical, Electrical/Electronic, Mechatronic Engineering, or related engineering discipline.

Fresh graduates are encouraged to apply.

Knowledge of equipment maintenance and troubleshooting.

Ability to interpret electrical circuit diagrams and engineering drawings.

Familiarity with AutoCAD, SolidWorks, or other 3D CAD software.

Strong analytical and problem-solving skills.

Good communication and teamwork abilities.

Willing to work in a fast-paced manufacturing environment.

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a