TECHNICIAN 4, MANUFACTURING

onsemi; Seremban; On-site; MYR 30,000 - 45,000; Full time

Job summary

onsemi in Malaysia is seeking skilled Technicians to support semiconductor manufacturing operations. This role involves operating specialized equipment for Die Bonding and Wire Bonding, ensuring quality standards, and performing routine checks and minor maintenance.

The ideal candidates should have a Certificate/Diploma in relevant fields and possess strong teamwork and troubleshooting skills. Experience in semiconductor processes is a plus.

Qualifications

• Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields.
• Experience in semiconductor processes is an advantage.
• Basic troubleshooting and machine-handling skills.

Responsibilities

• Operate and monitor die bond/clip bonder machines for stable production output.
• Conduct machine checks, cleaning, and minor preventive maintenance.
• Record production data accurately and ensure proper documentation.

Skills

Troubleshooting skills

Teamwork

Communication skills

Education

Certificate/Diploma in Electrical, Mechanical, Mechatronics

Job description

Job Description

onsemi is seeking skilled Technicians to support semiconductor manufacturing operations in areas such as Die Bond/Clip Bonding, Wire Bonding. The role involves operating and monitoring specialized equipment, performing machine setups, and ensuring production processes meet onsemi quality standards. Technicians will conduct routine checks, minor preventive maintenance, troubleshoot issues, and assist in process improvements. Accurate data recording, adherence to 5S, safety, and ESD compliance, and strong teamwork are essential.

Ideal candidates hold a Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields, possess basic troubleshooting skills, and are willing to work shifts in a fast‑paced environment. Prior experience in semiconductor processes is an advantage.

Responsibilities

Die bond/Clip Bonder Technician – Job Description

• Operate and monitor die bond/clip bonder machines to ensure stable production output.
• Perform die/clip attach processes according to SOP, work instructions, and onsemi quality standards.
• Machine models involved include ASM ( AD838, Twin 832P, SD890A, AD832D ), and Shinkawa / Yamaha ( SPA 500, STC 500 ).
• Conduct machine set‑up (Minor/Major), alignment, recipe loading, and basic parameter adjustments.
• Perform regular machine checks, cleaning, and minor preventive maintenance.
• Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly.
• Assist in troubleshooting equipment issues and support engineering improvement activities.
• Record production data accurately in the system and ensure proper documentation.
• Ensure workplace 5S, safety compliance, and proper ESD handling at all times.

Wire Bonder Technician – Job Description

• Operate and monitor wire bonder machines to ensure stable production output.
• Perform wire bond processes according to SOP, work instructions, and onsemi quality standards.
• Machine models involved include ASM (Extreme family, Twin supreme, Eagle 60), Shinkawa / Yamaha (ACB 3000, ACB 1000, UTC 5100), and Kns (Connx Plus & Elite).
• Conduct machine set‑up (Minor/Major), alignment, recipe loading, and basic parameter adjustments.
• Perform regular machine checks, cleaning, and minor preventive maintenance.
• Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly.
• Assist in troubleshooting equipment issues and support engineering improvement activities.
• Record production data accurately in the system and ensure proper documentation.
• Ensure workplace 5S, safety compliance, and proper ESD handling at all times.

Qualifications

• Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields.
• Experience in semiconductor die attach/die bonding / wire bonding / mold‑trim / final test process is an added advantage.
• Able to work in shift.
• Basic troubleshooting and machine‑handling skills.
• Good teamwork, discipline, and communication skills.
• Willing to learn and adapt in fast‑paced production environment.