Semiconductor Die & Wire Bonding Technician

onsemi; Negeri Sembilan; On-site; Full time

Job description

Job Summary: Final test

Candidate with Diploma in Engineering discipline of Electrical/Mechatronic/Electronics with several years of experience in semiconductor testing environment is essential. Knowledge in turret-based handler, multisite discrete and analog testing methodology, automatic vision inspection covers various aspects such as lead, Coplan, marking, packages are Key to this job.

Job Description

Job Summary: Final test

Candidate with Diploma in Engineering discipline of Electrical/Mechatronic/Electronics with several years of experience in semiconductor testing environment is essential. Knowledge in turret-based handler, multisite discrete and analog testing methodology, automatic vision inspection covers various aspects such as lead, Coplan, marking, packages are Key to this job.

Job Summary: Front End

Seeking skilled Technicians to support semiconductor manufacturing operations in areas such as Die Bond/Clip Bonding, Wire Bonding The role involves operating and monitoring specialized equipment, performing machine setups, and ensuring production processes meet onsemi quality standards. Technicians will conduct routine checks, minor preventive maintenance, troubleshoot issues, and assist in process improvements. Accurate data recording, adherence to 5S, safety, and ESD compliance, and strong teamwork are essential.

Ideal candidates

hold a Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields, possess basic troubleshooting skills, and are willing to work shifts in a fast-paced environment. Prior experience in semiconductor processes is an advantage.

Responsibilities

Key Duties and Responsibilities

Final Test

• Carry out routine RCM task to ensure equipment in tip top condition.
• Check and service ownership machine to sustain and meet MTBA performance measurement.
• Attend repair ticket timely with adequate sense of urgency & skill, to ensure uptime is meet.
• Coordinate with shift ME in output focus related, perform troubleshooting, setup, or conversion to deliver on time.
• Isolate, segregate & narrow down genuine & non-genuine vision & test rejects, so that scrap is under control.
• Comply to process OCAP, SOP & buyoff checklist always to ensure quality output.

Front End

• Operate and monitor die bond/clip bonder machines to ensure stable production output.
• Perform die/clip attach processes according to SOP, work instructions, and Onsemi quality standards.
• Machine model involve will be ASM ( AD838, Twin 832P, SD890A, AD832D, ) & Shinkawa / Yamaha ( SPA 500, STC 500 )
• Conduct machine setup Minor/Major, alignment, recipe loading, and basic parameter adjustments.
• Perform regular machine checks, cleaning, and minor preventive maintenance.
• Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly.
• Assist in troubleshooting equipment issues and support engineering improvement activities.
• Record production data accurately in system and ensure proper documentation.
• Ensure workplace 5S, safety compliance, and proper ESD handling at all times.

Qualifications

Requirements:

• Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields.
• Experience in semiconductor die attach/die bonding / wire bonding/ mold-trim / final test process -turret-based handler, Gravity feed Test handler, multisite discrete and analog is an added advantage.
• Able to work in shift
• Basic troubleshooting and machine-handling skills.
• Good teamwork, discipline, and communication skills.
• Willing to learn and adapt in fast-paced production environment

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end-markets, onsemi is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high-growth megatrends such as vehicle electrification, advanced safety, alternative energy, and factory automation. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end-markets are responsible for two-thirds of global greenhouse gas emissions, providing an immense opportunity for onsemi to do its part in achieving a net-zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and onsemi is committed to applying its research and design expertise and adapting its own operations to achieve net-zero emissions by 2040.

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.