Staff Process Engineer

Renesaselectronics; Hang Tuah Jaya; On-site; MYR 85,000 - 140,000; Full time

Job summary

Renesas Electronics in Malaysia seeks a manufacturing/packaging engineer to qualify PQFN packages for SPS products, scale up production, and improve assembly yield, cost and capacity. You will collaborate with Test, Product, Quality and Operations to address feedback and drive continuous improvements.

You will manage lifecycle documents, coordinate supplier changes, and support NPI-to-production transfers while ensuring adherence to quality and reliability standards in a fast-paced manufacturing

Qualifications

• Degree in Mechanical, Materials, Physics, Chemistry or Applied Sciences.
• Experience in process engineering or package development for thin wafer handling and SPS solder attach processes.
• Knowledge of PQFNs/QFNs/WLCSP and leaded packages.
• Knowledge of wire bonding.
• Knowledge of SPC and JMP.
• Strong interpersonal and communication skills in English.
• Strong analytical, written communication and project management skills.

Responsibilities

• Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain / improve capacity and cost.
• Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
• Serve as the key manufacturing engineering interface for NPI-to-production transfers.
• Manage OSAT and contract manufacturing relationships supporting production.

Skills

Process engineering

Package development

Wire bonding

Quality & reliability

SPC

JMP

English proficiency

Project management

Education

Bachelor's degree in Mechanical, Materials, Physics, Chemistry or Applied Sciences

Tools

JMP

SPC software

Job description

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

Key Responsibilities

• Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain / improve capacity and cost.
• Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
• Serve as the key manufacturing engineering interface for NPI-to-production transfers.
• Manage OSAT and contract manufacturing relationships supporting production.

• Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
• Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
• Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
• Knowledge of wire bonding.
• Knowledge of SPC and statistical analysis software (such as JMP).
• Strong interpersonal and communication skills in English.
• Strong analytical, written communication and presentation skills. Able to manage large projects effectively.

Nice to haves

• Cu Clip, Thin Die, Power QFN
• Package development knowledge
• Experience transitioning products from Development to Production
• Experience supporting NPI to Mass Production

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.