Staff Failure Analysis Engineer

Power Integrations

George Town

On-site

MYR 120,000 - 180,000

Full time

8 days ago

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Job summary

Power Integrations is seeking a Staff Silicon Level Failure Analysis Engineer for PIM replacement. You will perform device-level FA to support RMA, customer issues, and internal investigations.

This role requires deep knowledge of power semiconductors, CMOS/bipolar devices, and hands-on experience with ATE, probing, XRAY, and microscopy. Excellent English is essential for reporting and customer communication.

Qualifications

  • Minimum 10 years in failure analysis of power semiconductors, analog, and/or mixed signal IC devices.
  • Hands-on failure analysis, fault isolation, and defect characterization tools and techniques (ATE, curve trace, nano/micro-probing, OBIRCH/EMMI microscopy, liquid crystal, CSAM, XRAY, FIB, SEM/EDX).
  • Understanding of digital/analog circuits, device physics, and IC fabrication processes.
  • Ability to interpret ATE data logs and various schematics.
  • Strong English reading/writing and customer-facing communication skills.

Responsibilities

  • Perform fault isolation and defect analysis on power ICs to identify root causes of failures.
  • Provide technical reports to customers on failure investigations.
  • Communicate results effectively to drive product/design/process improvements.
  • Engage with internal/external customers to address questions on FA results.

Skills

Failure analysis
Power ICs
Defect characterization
ATE
Cross-sectioning
X-ray

Education

BS in Electronic Engineering

Tools

OBIRCH/EMMI
XRAY

Job description

Description

Job Description for Staff Silicon Level FA Engineer for PIM (Anton’s Replacement)

Description

Job Description for Staff Silicon Level FA Engineer for PIM (Anton’s Replacement)

The Staff Silicon Level Failure Analysis Engineer will perform device level failure analysis to support RMA, customer issues, and internal engineering failure analysis requests.

Responsibilities
  • Performing fault isolation and defect analysis/characterization on power IC’s to identify root causes of product failures in power supply applications and/or in production test.
  • Provide comprehensive technical reports to customers on findings from product and power supply failure investigations.
  • Responsibility will also include effective verbal and written communication of results, which will be used to drive improvements in product design, process technology, and applications. Such communication will require, but not limited to, writing cogent and convincing technical reports suitable for internal/external customers.
  • Communicate with internal/external customers to address customer’s questions and concerns about failure analysis results.
Requirements
  • Minimum of 10 years of experience in failure analysis of power semiconductors, analog, and/or mixed signal IC devices.
  • Hands-on experience in failure analysis, electrical fault isolation, and defect characterization tools and techniques such as the following: ATE, curve trace, nano/micro-probing, OBIRCH/EMMI microscopy, liquid crystal, CSAM, XRAY, FIB, SEM/EDX and manual cross-sectioning and deprocessing techniques using both parallel-polishing and wet chemical etch techniques.
  • In-depth understanding of both digital and analog circuits, device physics and IC fabrication processes.
  • Ability to interpret IC ATE test data log is required. Ability to interpret system level (or PCB level) schematics, IC level schematics, and IC layout of CMOS and bipolar devices is required.
  • Excellent English speaking, reading and technical writing skill is required.
  • Candidates with direct experience in customer interface on resolution of customer quality problems will be given special consideration.
  • Candidates with background and experience in automotive failure analysis/customer communication will be given special consideration.

Preferences will be given to candidates who have a thorough understanding of Switch Mode Power Supply Design (SMPS) and different AC to DC power conversion topologies; hands-on experiences in performing testing and fault isolation techniques/skills at power supply system level (or PCB level).

Education
  • BS in Electronic Engineering or equivalent discipline is required. A candidate with MSEE will be given preference.
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