Staff Failure Analysis Engineer

Power Integrations

Malaysia

On-site

MYR 120,000 - 240,000

Full time

12 days ago

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Job summary

Power Integrations in Malaysia seeks a Staff Silicon Level Failure Analysis Engineer to lead device-level FA for RMAs, customer issues, and internal failure investigations.

The role requires extensive fault isolation and defect analysis of power ICs, with strong written and verbal communication to drive design and process improvements. BS in Electronic Engineering and 10 years FA experience are required; MSEE is a plus.

Qualifications

  • Minimum 10 years of experience in failure analysis of power semiconductors, analog, and/or mixed signal IC devices.
  • Expertise in fault isolation and defect characterization tools and techniques is required.
  • Strong understanding of digital and analog circuits, device physics and IC fabrication processes is essential.
  • Ability to interpret IC ATE data logs and schematics at both IC and PCB levels.

Responsibilities

  • Performing fault isolation and defect analysis/characterization on power ICs to identify root causes of product failures.
  • Provide comprehensive technical reports to customers on findings from failure investigations.
  • Communicate results clearly to drive improvements in product design, process technology, and applications.
  • Coordinate with internal/external customers to address questions about failure analysis results.

Skills

Failure analysis
Power semiconductors
CMOS & Bipolar knowledge

Education

BS in Electronic Engineering
MSEE preferred

Tools

ATE
curve trace
nano/micro-probing
OBIRCH/EMMI microscopy
XRAY
FIB
SEM/EDX

Job description

Job Description for Staff Silicon Level FA Engineer for PIM (Anton’s Replacement)

The Staff Silicon Level Failure Analysis Engineer will perform device level failure analysis to support RMA, customer issues, and internal engineering failure analysis requests.

Responsibilities:
  • Performing fault isolation and defect analysis/characterization on power IC’s to identify root causes of product failures in power supply applications and/or in production test.
  • Provide comprehensive technical reports to customers on findings from product and power supply failure investigations.
  • Responsibility will also include effective verbal and written communication of results, which will be used to drive improvements in product design, process technology, and applications. Such communication will require, but not limited to, writing cogent and convincing technical reports suitable for internal/external customers.
  • Communicate with internal/external customers to address customer’s questions and concerns about failure analysis results.
Requirements:
  • Minimum of 10 years of experience in failure analysis of power semiconductors, analog, and/or mixed signal IC devices.
  • Hands-on experience in failure analysis, electrical fault isolation, and defect characterization tools and techniques such as the following: ATE, curve trace, nano/micro-probing, OBIRCH/EMMI microscopy, liquid crystal, CSAM, XRAY, FIB, SEM/EDX and manual cross-sectioning and deprocessing techniques using both parallel-polishing and wet chemical etch techniques.
  • In-depth understanding of both digital and analog circuits, device physics and IC fabrication processes.
  • Ability to interpret IC ATE test data log is required. Ability to interpret system level (or PCB level) schematics, IC level schematics, and IC layout of CMOS and bipolar devices is required.
  • Excellent English speaking, reading and technical writing skill is required.
  • Candidates with direct experience in customer interface on resolution of customer quality problems will be given special consideration.
  • Candidates with background and experience in automotive failure analysis/customer communication will be given special consideration.

Preferences will be given to candidates who have a thorough understanding of Switch Mode Power Supply Design (SMPS) and different AC to DC power conversion topologies; hands-on experiences in performing testing and fault isolation techniques/skills at power supply system level (or PCB level).

Education:
  • BS in Electronic Engineering or equivalent discipline is required. A candidate with MSEE will be given preference.
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