Senior Testchip Design Lead: End-to-End & Automation

Intel Corporation; George Town; Hybrid; MYR 180,000 - 240,000; Full time

Job summary

Intel Corporation in Malaysia seeks a senior engineer to lead end-to-end testchip design and execution for advanced process nodes, combining design rule validation, test structure design, and layout execution with cross‑functional collaboration.

You will own the full-flow layout across all cells, drive integration and Tape‑In readiness, and define automation and AI strategies to accelerate execution while mentoring junior engineers across distributed sites.

Qualifications

• 8+ years in layout design, test structure development, and DRC-clean sign-off on advanced nodes.
• Experience leading cross-site teams and delivering on schedule.
• Proficient in scripting for automation (Python, Tcl, Perl).

Responsibilities

• Lead end-to-end testchip design and delivery across blocks.
• Define test structure requirements and ensure DRC-clean sign-off.
• Drive automation and AI strategies to accelerate execution.
• Mentor engineers and align cross-site teams.

Skills

Layout design

Test structure development

Flow methodology

Scripting

Leadership

Education

Bachelor's degree in Electrical/Computer Engineering

Tools

Python

Tcl

Perl

Job description

Intel Corporation in Malaysia seeks a senior engineer to lead end-to-end testchip design and execution for advanced process nodes, combining design rule validation, test structure design, and layout execution with cross‑functional collaboration.

You will own the full-flow layout across all cells, drive integration and Tape‑In readiness, and define automation and AI strategies to accelerate execution while mentoring junior engineers across distributed sites.