Senior Test Engineer

ADI Resourcing; Ipoh; On-site; MYR 134,000 - 201,000; Full time

Job summary

ADI Resourcing is seeking a seasoned engineer with extensive wire bond process experience to establish and optimize test capability in a high-speed device environment. The role requires hands-on definition of process controls, PCPs, and yield-improvement actions within a multinational manufacturing setting.

Candidate should excel in cross-functional collaboration, lean execution, and have solid DOE/SPC background to drive quality and productivity in the test area.

Qualifications

• Minimum 5 years of working experience in wire bond process, preferably in high speed devices >1GHz.
• Experience in MNC manufacturing environment, preferably in metal can/TO can manufacturing line.
• Solid DOE and SPC experience.
• Good knowledge of FOL/semiconductor processes.
• Very good communication skills and ability to work effectively in a cross functional environment with people at all levels.

Responsibilities

• Establish the test capability and productivity model.
• Define the PCP and improving critical test capability (as defined in the process control plan, product drawings/specification and BOM).
• Fully understand the necessary controls, equipment, precautions, setup parameters to meet the product and test specifications.
• Apply lean manufacturing principles to eliminate waste in the production process and implement yield improvement projects.
• Responsible for the test yields of the designated process and to establish and implement actions to improve yields.

Skills

DOE experience

SPC experience

Communication skills

Cross-functional teamwork

Risk-based thinking

Tools

Lean manufacturing

Job description

• Establish the test capability and thecapacity/productivity model.
• Able to fully define and characterizethe designated process
• Define the PCP and improving criticaltest capability (as defined in the process control plan, productdrawings/ specification and BOM)
• Fully understand the necessarycontrols, equipment, precautions, setup parameters to meet theproduct and test specifications.
• Apply lean manufacturing principles toeliminate waste in the production process and implement yieldimprovement projects.
• Responsible for the test yields of thedesignated process. Responsible to establish and implement allappropriate actions to improve the yields.
• Responsible to conduct gagerepeatability & reliability studies, correlation studies as wellas actions to improve both these capabilities. Generate reactionplans for OOC situations
• Assist the manufacturing personnel inoperator training, qualification and improving operator utilizationand productivity as well as inventory reduction
• Communication skill to communicate andinterface well with peers, enhance teamwork
• Derive Continual Improvement and use ofresources
• Performing any other duties as directedby the immediate superior from time to time.
• Practice Risk Base Thinking in planningand execution of task.
• Compliance to ISO Requirements, companyrules & regulations, applicable codes etc.

JOBREQUIREMENTS

• Minimum 5years of working experience inwire bond process, preferably in the area of high speed devices>1GHz.
• Experience in MNC manufacturingenvironment, preferably in metal can/TO can manufacturing line.
• Solid DOE and SPC experience.
• Good knowledge of FOL/semiconductorprocesses.
• Very good communication skills andability to work effectively in a cross functional environment withpeople at all levels.