Senior FA & REL Engineer (Failure Analysis & Reliability)

TF-AMD Penang; Simpang Empat; On-site; MYR 180,000 - 300,000; Full time

Job summary

TF-AMD Penang is seeking a senior FA engineer to perform comprehensive failure analysis on semiconductor devices, advanced packages, or electronic systems from development through production stages.

You will plan and execute electrical, physical, and material analyses using advanced FA techniques, conduct RCA with data-driven conclusions, and utilize SEM, FIB, EDX, X-Ray, and related tools to support high-volume manufacturing and major customers. Leadership and mentorship are essential.

Qualifications

• Bachelor’s or Master’s Degree in Electrical, Electronics, Materials, Mechanical Engineering
• Minimum 8 years of experience in semiconductor FA/ REL, backend manufacturing, or advanced packaging
• Strong knowledge of failure physics, material interactions, and assembly processes
• Hands-on experience with FA tools (SEM, FIB, TDR, CSAM, X-Ray, grinding, wet etch, etc.) and REL tester
• Experience supporting high-volume manufacturing and key customer accounts
• Proven leadership in managing technical teams and complex escalations
• Advanced analytical and problem-solving skills
• Customer-focused with excellent communication skills
• Ability to perform under pressure in fast-paced manufacturing environments

Responsibilities

• Perform comprehensive failure analysis on semiconductor devices, advanced packages, or electronic systems across development and production stages
• Plan and execute electrical, physical, and material analyses using advanced FA techniques
• Independently conduct root cause analysis (RCA) and document clear, data-driven conclusions
• Utilize FA tools such as SEM, FIB, EDX, lock-in thermography, X-Ray, and probing techniques
• Interpret schematics, layouts, and test data to correlate failure mechanisms
• Support customer complaints, reliability issues, and qualification failures with timely and high-quality FA reports
• Drive corrective and preventive actions (CAPA) with cross-functional teams (Design, Process, Product, Manufacturing, Test)
• Develop and improve FA methodologies, best practices, and lab capabilities
• Mentor junior FA engineers and provide technical guidance as needed
• Ensure compliance with lab safety, quality, and documentation standards

Skills

Failure analysis

Root cause analysis

Cross-functional leadership

Analytical skills

Communication skills

Mentorship

Data analysis

Problem solving

Customer focus

Education

Bachelor’s or Master’s Degree in Electrical, Electronics, Materials, Mechanical Engineering

Tools

SEM

FIB

EDX

X-Ray

TDR

CSAM

Grinding

Wet etch

Job description

• Perform comprehensive failure analysis on semiconductor devices, advanced packages, or electronic systems across development and production stages
• Plan and execute electrical, physical, and material analyses using advanced FA techniques
• Independently conduct root cause analysis (RCA) and document clear, data-driven conclusions
• Utilize FA tools such as SEM, FIB, EDX, lock-in thermography, X-Ray, and probing techniques
• Interpret schematics, layouts, and test data to correlate failure mechanisms
• Support customer complaints, reliability issues, and qualification failures with timely and high-quality FA reports
• Drive corrective and preventive actions (CAPA) with cross-functional teams (Design, Process, Product, Manufacturing, Test)
• Develop and improve FA methodologies, best practices, and lab capabilities
• Mentor junior FA engineers and provide technical guidance as needed
• Ensure compliance with lab safety, quality, and documentation standards

Job Qualifications

• Bachelor’s or Master’s Degree in Electrical, Electronics, Materials, Mechanical Engineering, or related field.
• Minimum 8 years of experience in semiconductor FA/ REL, backend manufacturing, or advanced packaging.
• Strong knowledge of failure physics, material interactions, and assembly processes.
• Hands-on experience with FA tools (SEM, FIB, TDR, CSAM, X-Ray, grinding, wet etch, etc.) and REL tester.
• Experience supporting high-volume manufacturing and key customer accounts.
• Proven leadership in managing technical teams and complex escalations.
• Advanced analytical and problem-solving skills
• Customer-focused with excellent communication skills
• Ability to perform under pressure in fast-paced manufacturing environments

Nice to Have:

• Experience in Bumping, Wafer Level, Advanced packaging
• Exposure to OSAT or foundry environments
• Experience working with global customers
• Familiar with advanced lab analytical tool and techniques