Senior Optical Packaging Process Architect

COHERENT; Seberang Perai; Presencial; MYR 60 000 - 80 000; Tempo integral

Resumo da oferta

Coherent Corp. is seeking an experienced engineer to drive optical module packaging technologies and coordinate cross-functional development efforts. You will lead qualifications, develop process documentation, and manage new platform initiatives.

The role requires hands-on experience with die attach and wirebond, plus strong analytical and communication skills to collaborate with design, manufacturing, and quality teams. Onsite with travel expectations in the region.

Qualificações

• Bachelor's degree in materials/ mechanical / optical engineering
• 3–5+ years in semiconductor packaging processes (die attach / wire bonding / flip-chip / optical alignment)
• Hands-on experience with die attach and wirebond is a plus

Responsabilidades

• Follow optical module package trends, propose concepts, and develop a technology roadmap.
• Drive and coordinate package development with cross-functional teams including design, reviews, sample builds, and cost/capacity reviews.
• Carry out new package/process qualification, equipment/material introduction, and prepare process documents (flow, control plan, D/PFMEA, design guidelines).
• Track progress of new process development to ensure on-schedule delivery.
• Lead package-level failure analysis and maintain a lessons-learned database.
• Responsible for new technical releases and patent applications.
• Oversee new process platforms and optimize the process development system.

Conhecimentos

Interpersonal skills

Communication skills

Data analytics

Die attach

Wirebond

Learning quickly

Problem solving

Cross-functional collaboration

Optics knowledge

Formação académica

Bachelor's degree in materials/ mechanical / optical engineering

Master's degree preferred in materials/ mechanical / optical engineering

Ferramentas

Solidworks

EDrawings

JMP

Excel

Descrição da oferta de emprego

Coherent Corp. is seeking an experienced engineer to drive optical module packaging technologies and coordinate cross-functional development efforts. You will lead qualifications, develop process documentation, and manage new platform initiatives.

The role requires hands-on experience with die attach and wirebond, plus strong analytical and communication skills to collaborate with design, manufacturing, and quality teams. Onsite with travel expectations in the region.