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NXP Semiconductors Malaysia is seeking a specialist in FA sample preparation to support package‑level electrical FA and die‑level physical FA. The role requires hands‑on work with a broad range of FA techniques and a solid grounding in semiconductor processing and packaging.
You will contribute to developing new FA methods, participate in tool evaluation projects, and document results with clear conclusions and recommended actions. A relevant degree and 3+ years of experience are expected.
Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR. Operate precision milling/polishing systems and Reactive Ion Etching (RIE) systems for high-precision, site‑specific sample preparation for package‑level electrical FA (EFA) and die‑level physical FA (PFA). Perform die extraction for various package types and execute layer‑by‑layer polishing at the die level. Conduct sample preparation through grinding/polishing, chemical processing, and repackaging techniques. Document analysis results thoroughly, including detailed observations, conclusions, and recommended corrective actions. Contribute to the development of new FA techniques, methodologies, and recipes, as well as tool evaluation projects to support emerging technologies. Demonstrate a strong understanding of semiconductor manufacturing processes.
Bachelor’s or Master’s degree in Materials Science, Physics, Analytical Chemistry, or a related field. Proven experience (3+ years) in a semiconductor manufacturing or R&D environment; Wafer Fab experience is a plus. Hands‑on experience with a broad range of FA sample preparation tools and techniques. Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies.
More information about NXP in Malaysia... #LI-633a NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills. Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year‑on‑year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality.
Thank you for considering a career at NXP.