Senior Debug Technician / Engineer

NEXUSTEST TECHNOLOGY SDN. BHD.

Bayan Lepas

On-site

MYR 60,000 - 90,000

Full time

10 days ago
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Job summary

NEXUSTEST TECHNOLOGY SDN. BHD. in Penang seeks a skilled failure analysis engineer to diagnose instrument and PCBA faults across production and service environments.

You will perform systematic troubleshooting from system to component level, read schematics, use diagnostic tools, and lead root cause analyses with cross‑functional teams, delivering actionable containment and corrective actions.

Qualifications

  • Minimum Diploma in Electrical & Electronic Engineering, Electronics, Mechatronics, Instrumentation, Automation, or a related technical field.
  • Minimum 4 years of relevant experience in equipment troubleshooting, electronic repair, debug, test engineering, or a related technical role; semiconductor or manufacturing experience is preferred.
  • Hands‑on experience in PCBA troubleshooting, soldering, component replacement, and electronic circuit fault isolation is an advantage.
  • Able to read and interpret electrical schematics, wiring diagrams, PCB layouts, BOMs, and technical documentation.
  • Familiar with using test and measurement equipment such as digital multimeters, oscilloscopes, and DC power supplies.
  • Good understanding of electronic, electrical, mechanical, and electromechanical systems.
  • Strong troubleshooting, problem‑solving, analytical, and root cause analysis skills.
  • Familiar with structured problem‑solving methods such as 5 Why, Fishbone, or 8D is an advantage.
  • Good communication and teamwork skills with the ability to work effectively with Engineering, Production, Quality, and other cross‑functional teams.
  • Detail‑oriented, responsible, proactive, and able to work independently with minimal supervision.
  • Able to work under pressure and respond effectively to urgent production or technical issues.
  • Good command of English; Mandarin is an added advantage.

Responsibilities

  • Instrument System Troubleshooting and Fault Isolation across assembly, testing, burn‑in, and RMA.
  • PCBA and Electronic Circuit Troubleshooting including schematics reading and fault isolation.
  • Mechanical, Optical and System Integration Diagnosis and cross‑functional coordination.
  • Root Cause Analysis and Corrective Action with containment and preventive actions.
  • Rework, Repair and RMA Support including repair instructions and verification.
  • Production and Test Engineering Support for manufacturing troubleshooting.
  • Failure Analysis Documentation and Traceability.
  • Failure Trend and Data Analysis to identify high‑frequency failure modes.
  • Supplier and EMS Technical Support for supplier‑related issues.
  • Repairability and Diagnostic Improvement through standardized checks and guides.

Skills

PCBA troubleshooting
Soldering
Component replacement
Electrical schematics
Test equipment
Troubleshooting
Root cause analysis
Structured problem solving
Communication
Mechanical/electromechanical systems

Education

Diploma in Electrical & Electronic Engineering / Electronics / Mechatronics / Instrumentation / Automation

Tools

Digital multimeters
Oscilloscopes
DC power supplies

Job description


1. Instrument System Troubleshooting and Fault Isolation

Perform systematic troubleshooting, diagnosis, and fault isolation for failed instrumentation products during assembly, functional testing, burn-in, final testing, rework, and RMA activities.

Analyze failures from system level down to module, sub-assembly, PCBA, circuit, component, cable, connector, sensor, optical, mechanical, pneumatic, or other relevant levels.

Reproduce reported failure symptoms where necessary and establish clear failure conditions before commencing detailed troubleshooting.

Determine whether failures originate from electronics, power supply, wiring, connectors, sensors, optical components, mechanical assemblies, pneumatic systems, firmware/software interaction, workmanship, process conditions, or system integration.

Apply structured diagnostic methods and measurement techniques rather than relying on trial-and-error replacement of parts.

Compare failed units with known-good units, reference measurements, specifications, or system performance requirements where appropriate.

Escalate complex or unresolved technical issues with clear diagnostic findings and supporting evidence.

2. PCBA and Electronic Circuit Troubleshooting

Perform detailed PCBA troubleshooting where failures are suspected to originate from electronic circuits or components.

Read and interpret electrical schematics, circuit diagrams, PCB layouts, BOMs, wiring diagrams, test points, and technical specifications.

Diagnose abnormal power rails, signals, communication interfaces, open/short circuits, intermittent connections, component failures, soldering defects, damaged tracks, connector problems, and other electronic abnormalities.

Use appropriate diagnostic equipment such as digital multimeters, oscilloscopes, DC power supplies, signal generators, logic analyzers, and other electronic test instruments.

Identify defective components or circuit sections and recommend appropriate repair or replacement actions.

Verify repaired PCBAs before reintegration into the instrument and confirm proper system-level functionality following repair.

3. Mechanical, Optical and System Integration Diagnosis

Support troubleshooting of non-PCBA-related failures involving mechanical assemblies, cables, connectors, sensors, actuators, power supplies, optical components, pneumatic components, and other instrument subsystems.

Evaluate assembly alignment, mechanical fit, connection integrity, cable routing, sensor response, and subsystem interaction when investigating instrument failures.

Support troubleshooting of optical or photonics-related modules and components where applicable to the instrument.

Work with the relevant engineering discipline when specialized analysis is required while retaining ownership of the overall failure investigation and follow-up.

4. Root Cause Analysis and Corrective Action

Lead or support structured root-cause analysis for significant, recurring, or difficult instrument failures.

Collect and analyze failure symptoms, measurements, production history, repair findings, test data, and other relevant information.

Apply appropriate problem-solving methodologies such as 5 Why, Fishbone Analysis, 8D, fault-tree analysis, or other structured techniques.

Distinguish between immediate failure symptoms and the actual underlying root cause.

Work with Product Engineering, Process Engineering, Production, Quality, and other relevant teams to define effective containment, corrective, and preventive actions.

Track technical corrective actions to closure and verify their effectiveness.

5. Rework, Repair and RMA Support

Participate in technical review of production rejects, rework units, and customer-returned/RMA instruments.

Assess failure conditions and determine suitable troubleshooting, repair, recovery, or rework approaches.

Define or support technically sound repair and rework solutions together with Product Engineering, Process Engineering, and Quality.

Prepare or support preparation of repair instructions, rework procedures, diagnostic guidelines, and verification requirements.

Ensure approved repair and rework methods are properly implemented and controlled.

Verify that repaired or reworked instruments meet applicable functional and performance requirements before release.

Analyze repeated RMA and rework cases to identify systemic problems and opportunities for improvement.

6. Production and Test Engineering Support

Provide hands‑on troubleshooting support to Production and Test teams for instrument failures occurring during manufacturing.

Respond promptly to production‑stopping, high‑priority, or recurring technical issues.

Assist in determining whether failures are caused by product, PCBA, component, process, assembly, workmanship, test setup, or system integration issues.

Support temporary containment actions where required to maintain production while permanent solutions are being developed.

Work with Process Engineers and Product Engineers to implement corrective solutions and confirm effectiveness on the production floor.

Support engineering builds, pilot builds, trial runs, and product ramp‑up activities where troubleshooting or failure analysis capability is required.

Provide technical feedback to production teams regarding common failure modes and appropriate first‑level troubleshooting practices.

7. Failure Analysis Documentation and Traceability

Maintain complete and accurate records of failure symptoms, diagnostic steps, measurements, identified root causes, repair actions, and verification results.

Prepare clear debug reports, failure analysis reports, repair records, and technical investigation summaries.

Ensure failure records provide sufficient technical evidence and traceability for engineering, quality, supplier, and management review.

Maintain or contribute to a database of known failure modes, troubleshooting methods, and confirmed solutions.

8. Failure Trend and Data Analysis

Categorize instrument failures by failure mode, subsystem, root cause, component, supplier, process, or other relevant criteria.

Monitor recurring defects and support Pareto and trend analysis to identify high‑frequency or high‑impact failure modes.

Identify patterns that may indicate systemic component, supplier, manufacturing, or process weaknesses.

Provide failure data and technical insights to Product Engineering, Process Engineering, Quality, and Production for improvement actions.

9. Supplier and EMS Technical Support

Work with Quality, Purchasing, Product Engineering, and external EMS / PCBA / component suppliers when failures are potentially supplier‑related.

Provide clear failure symptoms, photographs, measurements, defective samples, and other technical evidence to support supplier investigations.

Support technical evaluation of supplier failure analysis, root‑cause findings, and corrective action reports.

Verify the effectiveness of supplier corrective actions through follow‑up testing or production monitoring where appropriate.

Highlight recurring supplier‑related defects and support escalation when corrective actions are ineffective.

10. Repairability and Diagnostic Improvement

Identify opportunities to improve the diagnosability and repairability of instruments.

Develop and maintain structured troubleshooting sequences, diagnostic checklists, known‑failure guides, and repair references.

Recommend additional test points, inspection checkpoints, diagnostic tools, fixtures, or test coverage where they can reduce troubleshooting time or prevent defect escape.

Work with relevant engineering teams to simplify repetitive troubleshooting activities and improve debug efficiency.

Support development of standard repair methods for recurring and technically understood failures.

11. Continuous Improvement and Defect Prevention

Analyze recurring production, test, rework, and RMA failures and recommend improvements to reduce defect recurrence.

Support corrective actions aimed at improving first‑pass yield, product reliability, manufacturing robustness, and repair turnaround time.

Work with Process Engineering to identify process‑related contributors to instrument failures.

Work with Product Engineering where product‑related technical changes are required to eliminate recurring failures.

Recommend improvements to assembly methods, testing coverage, inspection criteria, workmanship controls, or handling practices based on failure findings.

12. Cross‑Functional Technical Coordination

Work closely with Product Engineering, Process Engineering, Test Engineering, Production, Quality, Purchasing, Warehouse, and suppliers to resolve instrument‑related failures.

Communicate technical findings clearly and objectively to relevant stakeholders.

Participate in technical review meetings related to production failures, rework, RMA, supplier defects, and recurring reliability issues.

Follow through assigned technical actions to ensure issues are properly closed rather than only temporarily recovered.

Job Requirement

Minimum Diploma in Electrical & Electronic Engineering, Electronics, Mechatronics, Instrumentation, Automation, or a related technical field.

Minimum 4 years of relevant experience in equipment troubleshooting, electronic repair, debug, test engineering, or a related technical role; semiconductor or manufacturing experience is preferred.

Hands‑on experience in PCBA troubleshooting, soldering, component replacement, and electronic circuit fault isolation is an advantage.

Able to read and interpret electrical schematics, wiring diagrams, PCB layouts, BOMs, and technical documentation.

Familiar with using test and measurement equipment such as digital multimeters, oscilloscopes, and DC power supplies.

Good understanding of electronic, electrical, mechanical, and electromechanical systems.

Strong troubleshooting, problem‑solving, analytical, and root cause analysis skills.

Familiar with structured problem‑solving methods such as 5 Why, Fishbone, or 8D is an advantage.

Good communication and teamwork skills with the ability to work effectively with Engineering, Production, Quality, and other cross‑functional teams.

Detail‑oriented, responsible, proactive, and able to work independently with minimal supervision.

Able to work under pressure and respond effectively to urgent production or technical issues.

Good command of English; Mandarin is an added advantage.

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