Semiconductor Process Tech – Coating & Data, 12h Shift

Coherent Malaysia Sdn Bhd; Ipoh; On-site; MYR 67,000 - 100,000; Full time

Job summary

Coherent Malaysia Sdn Bhd in Ipoh is seeking an engineering-focused professional to support production and achieve key process KPIs. The role involves verifications, data collection, and buyoffs across wafer processes, with strong collaboration across teams.

The ideal candidate holds a Diploma in Engineering (Mechatronics preferred) with 3–5 years in semiconductor FOL areas such as wafer sawing and die attach, and demonstrates problem-solving and adaptability for a fast-paced onsite environment.

Qualifications

• Diploma in Engineering, preferably Mechatronics; 3–5 years in semiconductor FOL processes.
• Experience with wafer sawing, scribe/cleave, die sorting, die attach.
• Strong problem-solving and interpersonal skills; able to work 12-hour shifts.

Responsibilities

• Execute engineering tasks and support production to achieve process KPIs (Output, Quality, Scrap Cost).
• Perform periodic verifications and manage process fallout dispositions.
• Conduct buyoff activities for critical processes such as coating.
• Perform wafer data collection (WAT, SEM, SIM) for process engineers.
• Follow up on Special Build Requests and compile data summaries for review.
• Communicate with peers and cross-functional teams to enhance collaboration.
• Provide clear updates to ensure smooth daily operations.
• Drive continuous improvement initiatives and optimize resource utilization.
• Perform other duties as assigned.

Skills

Interpersonal skills

Problem solving

Analytical thinking

12-hour shift

SPC & OPAC

Mechanical tolerancing

Adaptable

Mechanical dimensioning

Education

Diploma in Engineering (Mechatronics)

Job description

Coherent Malaysia Sdn Bhd in Ipoh is seeking an engineering-focused professional to support production and achieve key process KPIs. The role involves verifications, data collection, and buyoffs across wafer processes, with strong collaboration across teams.

The ideal candidate holds a Diploma in Engineering (Mechatronics preferred) with 3–5 years in semiconductor FOL areas such as wafer sawing and die attach, and demonstrates problem-solving and adaptability for a fast-paced onsite environment.