Quality and Reliability Engineer

Intel Corporation; Penang; On-site; MYR 110,000 - 190,000; Full time

Job summary

Intel Corporation in Penang seeks a Manufacturing Quality and Reliability Engineer to support C4 bumping, wafer packaging, and 3D Foveros technologies. You will drive reliability across wafer fabrication through packaging, ensuring zero-defect mindsets and rapid containment of excursions.

The role emphasizes data extraction, statistical analysis, and collaboration with cross-functional teams to deliver robust product disposition and continuous quality improvements in a hybrid work model.

Qualifications

• Master's degree in a relevant field with work experience in semiconductor manufacturing.
• 5 years of semiconductor Manufacturing, C4 bumping and chip assembly experience.
• Experience in solder joint reliability, excursion management, and failure analysis.
• Proficiency in statistics and data analytics tools for quality and reliability assessments.
• Experience with data mining to synthesize insights from structured and unstructured data.

Responsibilities

• Chair MRB meetings and drive containment strategies and corrective actions.
• Communicate with Foundry partners and Intel customers.
• Provide input on solder joint reliability and thermomechanical interactions across wafer, die and package.
• Collaborate with cross-functional teams on Root Cause and 8D actions.
• Develop systems for early detection and containment of excursions.

Skills

Communication

Data analytics

Statistical analysis

Problem solving

Education

Master's degree in Materials Science/Physics/Chemical/Mechanical Engineering

Bachelor's degree in related field

Tools

Data mining tools

Statistics software

Job description

Job Details: Job Description: The Role and Impact: We are seeking a passionate Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site supporting Intel's packaging programs. The scope will be supporting C4 bumping and interconnect quality for WPM (wafer packaging manufacturing/ 3D Foveros technology) and ATM (assembly technology Mfg/ traditional package level assembly). You will play a critical role in ensuring our products and bumping processes meet the highest quality and reliability standards from wafer fabrication through packaging and assembly. This position is pivotal to the success of our manufacturing operations, directly impacting the performance of our products and customer satisfaction. By driving continuous process improvements and proactive quality initiatives, you will contribute to building a culture of excellence while helping Intel maintain its reputation as an industry leader. This role provides the opportunity to influence development forums, and factory operations while advancing cutting-edge manufacturing practices.

Key Responsibilities

• Manage manufacturing excursions while driving continuous improvement: chair MRB meetings, drive containment strategies, rapid product risk assessments and discrepant material dispositions (3D).
• Effectively communicate with internal Foundry partners and Intel customers.
• Provide technical input on solder joint reliability and thermomechanical interactions between wafer, die, and package to support risk assessment and technical decision-making.
• Collaborate with cross-functional teams to drive effective Root Cause and systemic Corrective actions (8D's).
• Develop and implement systems for early detection and containment of excursions.
• Own and continuously enhance material disposition RFC's, eDispo screens, and other QnR best known methods.
• Support factory Operations and output commits, e.g. daily/ timely material disposition and die inking for meeting commits.
• Support technology certification and ramp activities collaborating with TD and ramp partners.
• Use data extraction tools, custom scripting and statistical analysis techniques to assess and present inline, EOL, and Reliability data.
• Extract insights from structured and unstructured data using statistics and machine learning to determine product disposition.

Minimum Qualifications

• Master's degree in Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field of study with relevant work experience in semiconductor Manufacturing, C4 bumping process and chip assembly.
• 5 years of relevant work experience in semiconductor Manufacturing, C4 bumping process, and chip assembly with a bachelor's degree.
• Experience in solder joint reliability, excursion management, and failure mode analysis.
• Proficiency in statistics and data analytics tools for quality and reliability assessments.
• Experience with data mining to synthesize insights from structured and unstructured data.
• Familiar with QnR Quality Systems and tools.
• Effective verbal and written communication, and effective meetings skills.
• Motivated self-starter and self-driven learner to develop skills in various semiconductor and chip assembly processes.
• Demonstrate strong Quality and Zero-defect mindset, and Intel values of Velocity, Efficiency, and Customer 1st.
• Be comfortable working in a diverse environment and across geographies.

Preferred Qualifications

• Influencing skills to drive a quality-focused mindset across the organization.
• Proven ability to manage impactful Material Review Boards (MRBs).

Job Type and Shift

Job Type: Experienced Hire
Shift: Shift 1 (Malaysia)

Location

Primary Location: Malaysia, Penang
Additional Locations: (none listed)

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Additional Information

Job posting details (such as work model, location or time type) are subject to change.

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.