Hybrid Quality & Reliability Engineer — Semiconductor Packaging

Intel Corporation; Penang; Hybrid; MYR 110,000 - 170,000; Full time

Job summary

Intel Corporation in Penang seeks a Manufacturing Quality and Reliability Engineer to strengthen the Foundry QnR team, supporting C4 bumping, wafer packaging, and 3D Foveros technology. You will drive product reliability from wafer fabrication through packaging, leading continuous improvement and quality initiatives.

The role collaborates across functions, chairs MRB meetings, analyzes reliability data, and helps define containment and corrective actions.

Qualifications

• Master’s degree in Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field with semiconductor manufacturing experience.
• 5 years of relevant work experience in semiconductor manufacturing, C4 bumping and chip assembly with a bachelor’s degree.
• Experience in solder joint reliability, excursion management, and failure mode analysis.
• Proficiency in statistics and data analytics tools for quality and reliability assessments.
• Experience with data mining to synthesize insights from structured and unstructured data.
• Familiar with QnR Quality Systems and tools.
• Strong verbal and written communication and meeting skills.
• Motivated self-starter and ability to learn across semiconductor processes; a robust quality mindset.

Responsibilities

• Chair MRB meetings and drive containment strategies for excursions.
• Provide input on solder joint reliability and thermomechanical interactions to support risk assessment.
• Collaborate with cross-functional teams to drive 8D corrective actions.
• Develop and implement early detection and containment systems for excursions.
• Manage material disposition RFCs, eDispo screens, and QnR methods.
• Support Operations and daily material disposition to meet production commitments.
• Assist technology certification and ramp activities with TD and ramp partners.
• Use data extraction tools and statistical analyses to assess inline, EOL, and reliability data.
• Extract insights from data using statistics and ML to determine product disposition.

Skills

Solder joint reliability

Excursion management

Failure mode analysis

Statistics & data analytics

Data mining

QnR Quality Systems

Cross-functional communication

Adaptability in diverse environment

Education

Master’s degree in Materials/Physics/Chemical/Mechanical Eng

Bachelor’s degree in related field

Job description

Intel Corporation in Penang seeks a Manufacturing Quality and Reliability Engineer to strengthen the Foundry QnR team, supporting C4 bumping, wafer packaging, and 3D Foveros technology. You will drive product reliability from wafer fabrication through packaging, leading continuous improvement and quality initiatives.

The role collaborates across functions, chairs MRB meetings, analyzes reliability data, and helps define containment and corrective actions.