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Chipbond Technology Malaysia Sdn. Bhd. is expanding its production team in Penang, Malaysia.
The role involves operating machines for loading/unloading materials, inspecting products with optical microscopes, and supporting quality, logistics, and packaging tasks. The position requires willingness to work in a shift-rotation schedule and strong English communication. The team emphasizes adherence to quality standards and participation in regular supervisor briefings to review performance and
1. Operate machines for loading and unloading materials
2. Use optical microscopes to inspect product quality
3. Use vacuum pens to pick up wafers for quality inspection
4. Operate plating-area machines for loading and unloading wafers
5. Perform photo-area operations and use optical microscopes
6. Conduct incoming material inspection and perform packaging operations
7. Send shipping reports via email
8. Manage quality, output, logistics, and discipline of personnel at the workstation
9. Regular monthly meeting for selected supervisors/technicians: Briefings and Performance Review.
Job Requirement:
1. Able to speak, read and write English.
2. Able to work in shift rotation schedule.
Hirer responsiveness Salary match Number of applicants
Consumer Electronics Manufacturing 101-1,000 employees
Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park
We have expanded the operations to 6 locations with approximately 5,200 people
We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.
We are expanding our footprint to Penang, Malaysia, Let's join us as Pioneer Team!
Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park
We have expanded the operations to 6 locations with approximately 5,200 people
We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.
We are expanding our footprint to Penang, Malaysia, Let's join us as Pioneer Team!
What can I earn as a Production Operator