Process Engineer (FCBGA)

TF AMD; Bayan Lepas; On-site; MYR 80,000 - 100,000; Full time

Job summary

A technology company in Malaysia is seeking an Engineering Manager to oversee product sustaining activities, including performance improvement and cost reduction efforts. The ideal candidate will have a Bachelor's Degree in Engineering and at least 5 years of experience in IC packaging, particularly with FCBGA techniques. Responsibilities include managing new product development processes and training engineers specialized in sustaining processes. This role requires collaboration with various teams to drive improvements and handle quality issues.

Qualifications

• At least 5 years of experience in IC packaging.
• Must possess at least a Bachelor's Degree in relevant engineering fields.
• Preferred fundamental knowledge in mechanical design.

Responsibilities

• Manage product sustaining activities focusing on performance improvement and cost reduction.
• Execute BOM projects for New Advanced Technology Products.
• Develop and retain engineers specializing in sustaining processes.

Skills

FCBGA

Statistical data analysis

Quality Control techniques

Education

Bachelor's Degree in Engineering

Tools

Vision inspection equipment

Pick & Place handler

Job description

Management of product sustaining activities which include driving product performance improvement (yield, quality, etc.) and cost reduction.

Drive on VM yield improvement across processes. Manage yield performance with customer and work on baseline yield improvement

Managing the sustaining process and executing independently BOM (Bill of Material) project for New Advanced Technology Products, Design of Experiment (DOE) and processes.

Managing the engineering activities during new product development including product definition, performance characterization, qualification, and release to production.

Manage product ramp to yield entitlement.

Managing the Quality matter with the approach of Statistical data analysis (Statistical Validation), 8 basic QC tools and FMEA.

Drive all margin issues with operations and development teams.

Work with the Manufacturing, Design, Quality, and equipment team in the disposition of product excursions and manage cases through a material review board.

Train, develop and retain Engineer with the sustaining process specialized in Flip Chip Ball Grid Array (FCBGA).

Other duties assign by supervisor.

Job Requirements

Candidate must possess at least Bachelor's Degree/Post Graduate Diploma/Professional Degree in Engineering (Computer/Telecommunication), Engineering (Electrical/Electronic), Engineering (Mechanical), Engineering (Mechatronic/Electromechanical) or equivalent.

Require at least 5 years of experienced in IC packaging.

Required Skill(s) FCBGA

Preferred to have some fundamental levels of knowledge in vision inspection equipment, Pick & Place (PnP) handler and mechanical design.