Principal Engineer Equipment Engineering (Wire Bond)

Infineon Technologies (Malaysia) Sdn Bhd; Malacca City; On-site; MYR 132,000 - 168,000; Full time

Job summary

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Principal Engineer Equipment Engineering to lead a technical team focused on defining and executing comprehensive planned maintenance and reliability programs for wire-bond equipment.

The role emphasizes governance, systematic maintenance, 8D/ DMAIC problem solving, and cross‑functional collaboration to ensure high equipment availability within budget and safety standards.

Qualifications

• Minimum 8 years in semiconductor industry (wire bond).
• Bachelor or Master in Mechanical/Electronics/Automation Engineering.
• Strong knowledge of 8D and DMAIC methodologies.

Responsibilities

• Lead a technical team to plan maintenance and equipment reliability.
• Develop and implement preventive maintenance and governance.
• Set and implement equipment governance direction with KPIs.
• Integrate equipment with APC tools and drive improvements.
• Certify engineers and technicians per competency model.
• Drive improvements to meet/exceed defined targets.

Skills

Team leadership

Maintenance planning

8D problem solving

DMAIC

Risk mitigation

Cross-functional

Communication

Education

Bachelor or Master in Mechanical/Electronics/Automation Engineering

Tools

APC tools

Job description

#WeAreIn for jobs that impact everyone's life. Help us shape the foundation that keeps Infineon’s production running – stable, safe, and ready for the future. As a Principal Engineer Equipment Engineering, your contribution ensures that innovation never stands still. Together, we make reliability our strongest asset. Are you in?

Your role
Key responsibilities in your new role

Drive andlead a technical teamto build planned maintenance definition to have comprehensive equipment maintenance and robustness preventive in place and timely

Drive andgather previous maintenance improvement activitiesas to ensure that new machine reaches its optimal performance much early than usual and, develop standard hardware and software to governance

Setand implement wire bond equipment govern direction; effective indicators, monitoring, driving equipment improvement in the defined area of responsibility

Setupand implement planned maintenance systematicto ensure comprehensive equipment maintenance routines that all equipment is safe to operate, with high availability and good reliability within targeted budget

Establish andimplement systematic equipment improvement, preventive maintenance, calibration, and implement countermeasures to prevent repetitive breakdowns

Serve as Equipment Governance owner from conceptualization, piloting, implementation, monitoring, improving, and sustaining

Monitor equipment stability by integrate equipment with APC tools or semi auto integration system

Responsible for implementingand executing equipment improvement topics to meet/exceed TCR

Responsible to develop, evaluate, and certify the Engineer and Technician team in according to the define competency model

Your profile
Qualifications and skills to help you succeed

Bacheloror MastersDegree in Mechanical/Electronics/Automation Engineering is preferred

At least 8 yearsof working experience in Semiconductor Industry (Wire bond process)

Deep knowledge in 8Dand DMAIC problem-solving methodology

Able todetectandmitigate risk early

Able to lead team to drive for results

Good communicator, able to work in cross-functional projects

What can I earn as an Equipment Engineer