NPI Senior Engineer - Assembly Process

Randstad – Renesas; Penang; On-site; MYR 78,000 - 134,000; Full time

Job summary

Randstad – Renesas in Penang, Malaysia, is seeking an engineer to drive New Product Introduction (NPI) and process optimization for semiconductor assembly and pre-assembly steps. You will lead NPI activities, perform device process window studies, and evaluate new materials while coordinating prototype samples and risk assessments.

Responsibilities include failure analysis, reporting, and proposing process conditions for mass production, with a focus on minimizing supervision and solving complex

Qualifications

• Degree in Engineering/Science Discipline.
• Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly process (Wafer Backgrind/Dicing, Screen Print, Die & Clip Attached, Wire Bonding, molding & cutting) is an advantage.
• Ability to work with minimal supervision.
• Strong problem-solving skills.

Responsibilities

• Lead & drive NPI activities
• Responsible for new device process window study
• Perform risk assessment & identify technical challenges
• New material characteristic study & evaluation
• Failure analysis & reporting
• Prototype sample build & characteristic check
• Propose process condition for mass production

Skills

Strong problem-solving skills

Ability to work with minimal supervise

Education

Degree in Engineering/Science Discipline

Job description

Involving in new product setup, process optimization, device qualification & prototype sample build.

Key Responsibilities

• Lead & drive NPI activities
• Responsible for new device process window study
• Perform risk assessment & identify technical challenges
• New material characteristic study & evaluation
• Failure analysis & reporting
• Prototype sample build & characteristic check
• Propose process condition for mass production

Qualifications

Degree in Engineering/Science Discipline

Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly process (Wafer Backgrind/Dicing, Screen Print, Die & Clip Attached, Wire Bonding, molding & cutting) is an advantage.

Ability to work with minimal supervision

Strong problem-solving skills