NPI Packaging & Process Engineer – AI‑Driven

Micron Technology, Inc.; Simpang Ampat; On-site; MYR 95,000 - 135,000; Full time

Job summary

Micron Technology, Inc. in Penang, Malaysia seeks a PDE CEM Engineer to develop and optimize backend assembly processes and manage NPI-to-HVM transfers. You will validate POR/TOR/BOMs and drive process improvements with data-driven methods.

Responsibilities include executing NPI package qualifications, building customer samples, and leading containment and corrective actions. Fresh graduates or 1–2 years’ experience are encouraged to apply; strong problem-solving and teamwork are essential.

Qualifications

• Masters or bachelor’s degree in an Engineering
• Experience in backend engineering process or assembly package technology development preferred
• Fresh graduates/highly motivated individuals with 1-2 years' working experience are encouraged to apply
• Excellent problem-solving skill, and good in data analysis, statistical analysis, data interpretation skills
• A good teammate equips with excellent interpersonal and communication skills.
• Highly result driven individual, self-motivated and ability to multi-task and lead multifaceted priorities

Responsibilities

• Implement smooth transfer of new products and packages from NPI to HVM site
• Work with multi-functional team and sites to complete smooth products transfer
• Validate and document baseline the POR, TOR and BOM for the transferred products and packages
• Execution of the qualification of NPI packages build that proliferate from the pilot products and packages according to planned timeline
• Execution of NPI Customer samples and Engineering Samples build for new products and packages according to planned timeline
• Evaluate and Improve Assigned Assembly Processes, Materials, and/or Equipment
• Participate in process, tool and material optimization to drive best in class packaging solutions and ensure first pass NPI qualification. Provide ideas for cost reduction
• Maintain in-depth assembly process and packaging knowledge, included materials and equipment knowledge as packaging integration.
• Identify all process variables, and Optimize process and/or equipment variables
• Perform containment of process and equipment deviations, and lead root cause finding and implement corrective actions
• Develop Process of Record (POR), define process edges and center the process (CPK), Apply DOE (Design of Experiments) techniques for process characterization
• Develop Process Capability Roadmap and Evaluate Equipment and/or Material Technologies

Skills

Problem solving

Data analysis

Statistical analysis

Data interpretation

Interpersonal skills

Communication skills

Multi-tasking

Teamwork

Education

Masters or Bachelor's degree in Engineering

Job description

Micron Technology, Inc. in Penang, Malaysia seeks a PDE CEM Engineer to develop and optimize backend assembly processes and manage NPI-to-HVM transfers. You will validate POR/TOR/BOMs and drive process improvements with data-driven methods.

Responsibilities include executing NPI package qualifications, building customer samples, and leading containment and corrective actions. Fresh graduates or 1–2 years’ experience are encouraged to apply; strong problem-solving and teamwork are essential.