Module Engineer (Contract)

Intel Technology Sdn. Bhd.; Bayan Lepas; On-site; MYR 120,000 - 180,000; Full time

Benefits offered by this job

Medical

Miscellaneous allowance

Education support

Dental

Sports

Parking

Vision

Meal subsidy

Job summary

Intel Technology Sdn. Bhd. in Penang is seeking a senior process engineer to own Ball Attach manufacturing, drive yield improvements, and collaborate with multiple engineering teams to ensure safety, quality, and productivity targets.

You will optimize equipment performance, support tool readiness, and lead process qualifications across local and global sites while maintaining comprehensive process documentation.

Qualifications

• 4+ years of relevant experience with Bachelor’s degree; 3 years with Master’s; 0 years with PhD.
• Experience in semiconductor manufacturing environments (assembly/packaging/high-volume).
• Knowledge of process engineering fundamentals and statistical methods; strong problem-solving skills.
• Experience in Ball Attach, Die Attach, Flip Chip, Advanced Packaging, Assembly, or Backend semiconductor processes (preferred).
• Proficiency in DOE, SPC, FMEA, and root cause analysis (preferred).
• Strong understanding of semiconductor equipment, process characterization, and yield improvement techniques (preferred).
• Experience with equipment qualification, troubleshooting, maintenance coordination, and performance optimization (preferred).

Responsibilities

• Own and sustain Ball Attach manufacturing processes and equipment to meet safety, quality, productivity, and yield targets.
• Monitor and control key process parameters to ensure compliance with specifications.
• Perform process characterization, troubleshooting, root cause analysis, and corrective actions.
• Drive continuous improvement via DOE, SPC, and data-driven methods to optimize process capability and equipment performance.
• Partner with vendors and internal teams to improve tool reliability and manufacturing readiness.
• Develop and implement preventive measures to minimize excursions, defects, and issues.
• Support equipment installation, qualification, conversion, and ramp activities with safety and quality in mind.
• Collaborate with Process Engineering, Manufacturing, Quality, Product Engineering, and Equipment Engineering to resolve challenges.
• Lead technology transfers, process qualifications, and manufacturing readiness across sites.
• Maintain process docs, SOPs, specs, and reports for operational excellence.

Skills

Ball Attach

Die Attach

Flip Chip

Advanced Packaging

Assembly

Backend Manufacturing

DOE

SPC

FMEA

Root Cause Analysis

Process Engineering Fundamentals

Statistical Analysis

Problem Solving

Equipment Qualification

Troubleshooting

Maintenance Coordination

Performance Optimization

Design of Experiments

Education

Bachelor’s in Engineering

Job description

Key responsibilities

Own and sustain Ball Attach manufacturing processes and equipment to achieve safety, quality, productivity, and yield targets.

Monitor and control key process parameters to ensure compliance with product specifications and manufacturing requirements.

Perform process characterization, troubleshooting, root cause analysis, and corrective actions to address yield, quality, and reliability challenges.

Drive continuous improvement initiatives through DOE, SPC, and data-driven methodologies to optimize process capability and equipment performance.

Partner with equipment vendors and internal stakeholders to improve tool reliability, utilization, and manufacturing readiness.

Develop and implement preventive measures to minimize process excursions, defects, and equipment-related issues.

Support equipment installation, qualification, conversion, and production ramp activities while ensuring adherence to safety and quality standards.

Collaborate with cross-functional teams including Process Engineering, Manufacturing, Quality, Product Engineering, and Equipment Engineering to resolve technical challenges.

Lead technology transfers, process qualifications, and manufacturing readiness activities across local and global sites.

Maintain process documentation, operating procedures, specifications, and technical reports to support operational excellence.

About you

Bachelor's degree in Electrical Engineering, Electronic Engineering, Mechanical Engineering, Chemical Engineering, Materials Engineering, Physics, Semiconductor Technology, or a related discipline.

Minimum 4 years of relevant experience with a Bachelor's degree, 3 years with a Master's degree, or 0 years with a PhD.

Experience in semiconductor manufacturing, assembly, packaging, or high-volume manufacturing environments.

Knowledge of process engineering fundamentals, statistical analysis, and problem-solving methodologies.

Experience in Ball Attach, Die Attach, Flip Chip, Advanced Packaging, Assembly, or Backend Semiconductor Manufacturing processes (preferred).

Proficiency in Design of Experiments (DOE), Statistical Process Control (SPC), FMEA, and Root Cause Analysis methodologies (preferred).

Strong understanding of semiconductor manufacturing equipment, process characterization, and yield improvement techniques (preferred).

Experience with equipment qualification, troubleshooting, maintenance coordination, and performance optimization (preferred).

Consumer Electronics Manufacturing More than 10,000 employees

Intel Corporation (NASDAQ:INTC) expands the boundaries of technology to make the most amazing experiences possible. You may know us for our processors, but we do so much more. From powering the latest devices and the cloud you depend on, to driving policy, diversity, sustainability and education, we create value for our stockholders, customers and society.

Intel Corporation chose Penang, Malaysia as its first offshore location outside of the United States in 1972. Intel’s initial investment in Malaysia has grown significantly since then and as a result, Malaysia’s operations has further expanded to Kulim, Kedah in 1996, becoming one of Intel’s most comprehensive sites.

Intel Corporation (NASDAQ:INTC) expands the boundaries of technology to make the most amazing experiences possible. You may know us for our processors, but we do so much more. From powering the latest devices and the cloud you depend on, to driving policy, diversity, sustainability and education, we create value for our stockholders, customers and society.

Intel Corporation chose Penang, Malaysia as its first offshore location outside of the United States in 1972. Intel’s initial investment in Malaysia has grown significantly since then and as a result, Malaysia’s operations has further expanded to Kulim, Kedah in 1996, becoming one of Intel’s most comprehensive sites.

Perks and benefits

• Medical
• Miscellaneous allowance
• Education support
• Dental
• Sports (e.g. Gym)
• Parking
• Vision
• meal subsidy, daily free fruits, mother's room, mo