Modeling & Simulation Senior Staff Engineer

Ams Osram; Malaysia; On-site; MYR 40,000 - 60,000; Full time

Job summary

Ams Osram in Malaysia is seeking qualified engineers to develop, validate, and apply finite element analysis for LED chips and packaging. The role includes providing support to the Technology and R&D teams from concept to product development. Ideal candidates will possess a strong understanding of applied mechanics and have hands-on experience with FEA and CAD tools, alongside excellent analytical and communication skills. This position offers an opportunity to enhance product performance using advanced simulation techniques.

Qualifications

• Strong understanding of applied mechanics, with emphasis on analytical, computational, and measurement methods.
• Hands-on experience with simulation tools and CAD tools.
• Experience in optoelectronic material characterization methodologies and analysis.

Responsibilities

• Develop, validate, and apply finite element analysis for LED chips and packages.
• Provide interdisciplinary support to the Technology and R&D team from concept to product.
• Support the development team in identifying and preventing early-stage design issues.

Skills

Finite element analysis

Analytical methods

Simulation tools (ANSYS/COMSOL)

Computer programming (Matlab, C++)

Education

Ph.D/Master’s/Bachelor’s degree in Mechanical Engineering, Computational Mechanics, Materials Science, Physics, or Mathematics

Tools

FEA or CFD tools

CAD tools

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

• Develop, validate, and apply finite element analysis for LED chips & packages development project.
• Provide interdisciplinary support to the Technology & R&D team from concept to product.
• Support the development team in identifying and preventing early-stage design issues and risks.
• Diagnose customer issues using physics-based explanations and recommend appropriate solutions.
• Recommend design and process improvements to enhance product performance.
• Drive development of leading-edge simulation approaches and advanced material modelling to improve accuracy and efficiency.
• Identify and leverage resources and expertise from research institutions/universities for relevant studies/projects.
• Provide technical guidance and coaching to junior engineers/peers through knowledge sharing.

• Ph.D/Master’s/Bachelor’s degree in Mechanical Engineering, Computational Mechanics, Materials Science, Physics, or Mathematics, with relevant industrial experience.
• Strong understanding of applied mechanics, with emphasis on analytical, computational, and measurement methods.
• Hands‑on experience with simulation tools (ANSYS/COMSOL/others FEA or CFD tools, etc.) and CAD tools.
• Experience in optoelectronic material characterization methodologies, analysis, and new concepts in model creation.
• Strong analytical thinking with excellent communication skills.
• Understanding of packaging technologies, assembly processes, opto-semiconductor packaging materials, reliability test requirements, and failure analysis techniques.
• Hands‑on computer programming skills (Matlab, C++, etc.) will be an added advantage.
• Experience in process modeling will be an added advantage.