Manufacturing Section Manager (Bump Wafer Area)

MVC Resources; Malacca City; On-site; MYR 180,000 - 320,000; Full time

Job summary

MVC Resources is seeking a Manufacturing Section Manager (Bump Wafer) in Melaka to own 24/7 high-volume operations. You will lead up to 200+ operators and technicians, drive OEE improvements, and ensure safety and 5S discipline in a state-of-the-art facility.

Reporting to the Manufacturing Director, you will partner with process and equipment teams to deliver lean improvements, NPI ramp-ups, and sustainable manufacturing excellence in a back-end packaging environment.

Qualifications

• Education: Bachelor's degree in relevant engineering field.
• 5+ years of semiconductor or electronics manufacturing experience.
• 4+ years of direct managerial/supervisor experience.
• Domain expertise in back-end assembly, wafer-level packaging, or bump wafer manufacturing.
• Strong leadership, high-energy presence and ability to lead multi-shift teams.

Responsibilities

• Drive 24/7 high-volume manufacturing in the Bump Wafer area and achieve output targets.
• Lead and develop up to 200+ operators and technicians; ensure shift handover discipline.
• Collaborate with Process, Product, Yield and Equipment Engineering to drive Lean and NPI ramp-ups.

Skills

Semiconductor experience

Managerial experience

Multi-shift leadership

Lean/Six Sigma

Education

Bachelor's degree in Electrical/Electronic Engineering

Bachelor's degree in Microelectronics

Job description

Company Overview

Our client is a Global Semiconductor Pioneer & World Leader in High-Performance Analog, Mixed-Signal & Integrated Power Processing Technologies. With an expansive, state-of-the-art back-end manufacturing complex located in the Batu Berendam Free Trade Zone, Melaka, the organization supplies mission-critical semiconductor components to automotive, industrial, data center, and personal electronics markets worldwide. To drive high-volume production excellence, yield optimization, and operational discipline across its advanced packaging operations, executive leadership is seeking a high-calibrated Manufacturing Section Manager for the Bump Wafer manufacturing area.

Position Overview

Reporting directly to the Manufacturing Director, the Manufacturing Section Manager (Bump Wafer) holds complete operational ownership of 24/7 high-volume manufacturing within the Bump Wafer area. Leading a site workforce of up to 200+ operational personnel through direct Production Supervisors, this role drives daily wafer output, line cycle times, Overall Equipment Effectiveness (OEE), scrap reduction, and cleanroom 5S discipline. As a primary line leader, the incumbent serves as the central escalation point for line disruptions and yield deviations, maintaining on-call responsiveness for critical after-hours production events.

Key Responsibilities

1. High-Volume Manufacturing Execution & Line Ownership

• Drive 24/7 high-volume manufacturing (HVM) operations across the Bump Wafer area, achieving daily output targets, cycle time commitments, and line productivity metrics.

• Monitor and optimize Overall Equipment Effectiveness (OEE), scrap rates, wafer yield performance, and line balance across all bump process steps.

• Serve as the primary operational escalation point for critical line interruptions, quality deviations, and yield excursions, maintaining on-call responsiveness after office hours to ensure shift continuity.

2. Large-Scale Operational Leadership & People Management

• Lead, coach, and develop a large-scale shift workforce of up to 200+ operators and technicians via direct Production Supervisors.

• Enforce shift hand-over discipline, clear performance expectations, attendance tracking, and shopfloor accountability.

• Partner with HR and technical training teams to build multi-skilled technician capabilities and operator competency pipelines.

3. Process Collaboration, Lean Execution & NPI Ramp-Up

• Partner closely with Process, Product, Yield, and Equipment Engineering teams to execute Lean Manufacturing, Six Sigma (6-Sigma) projects, and continuous improvement initiatives.

• Facilitate smooth New Product Introduction (NPI) ramp-ups, pilot line validation trials, and technology transfer activities into full high-volume production.

• Enforce strict semiconductor cleanroom safety, 5S standards, Environmental Health & Safety (EHS) policies, and statutory compliance frameworks.

Requirements

• Education: Bachelor's Degree in Electrical/Electronic Engineering, Microelectronics, Mechanical Engineering, Chemical Engineering, Materials Science, or a related discipline.

• Overall Experience: Minimum 5+ years of progressive semiconductor or electronics manufacturing experience (ideally under 15 years total career tenure).

• Managerial Tenure: Minimum 4+ years of direct managerial or section head experience leading shopfloor manufacturing operations in a semiconductor environment.

• Domain Expertise: Proven track record in back-end assembly, wafer-level packaging (WLP), or Bump Wafer manufacturing operations.

• Leadership Attributes: High-energy operational presence, strong decision-making capabilities under line pressure, and demonstrated ability to lead large, multi-shift production workforces.