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Winbond Electronics Corp. in Ipoh, Malaysia is seeking a Test Equipment Engineer to support real-time troubleshooting and maintenance of semiconductor equipment. You will monitor utilization, lead maintenance activities, and drive equipment improvement projects to ensure high uptime.
Preference given to candidates with experience on Advantest T5830 tester maintenance, ACCRETECH AP3000 prober maintenance, or MJC/FFI probe cards, and the ability to manage preventive maintenance schedules.
Winbond was established in September 1987, stands out as one of the few companies worldwide with proprietary products and technology in both memory and logic integrated circuits. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total integrated circuits solutions.
As a Test Equipment Engineer at Winbond, you will provide real-time troubleshooting and resolution for equipment, perform preventive maintenance and repairs for equipment, monitor equipment utilization and availability, and execute equipment improvement projects.
*Experience with Advantest T5830 tester maintenance, ACCRETECH AP3000 prober maintenance, or MJC/FFI probe card maintenance is preferred
Your application will include the following questions: