Graduate Signal Integrity Engineer — Next-Gen Server Tech

AMD; Penang; Hybrid; MYR 180,000 - 240,000; Full time

Benefits offered by this job

Hybrid work model

Job summary

AMD Penang is seeking a Signal Integrity Design Engineer to define and verify SI specifications across server products. You will model and simulate SI for die, package, and board levels, collaborating with IC Design, Layout, Packaging, and other teams.

The role emphasizes hands-on analysis, measurement planning, and delivering robust channel performance for high-speed interfaces. You will participate in the development of next-generation product methodologies and work in a hybrid environment in

Qualifications

• Bachelor’s or Master’s in electrical or computer engineering.
• Experience in high-speed digital design or signal integrity.
• Strong modeling and verification skills for SI challenges.

Responsibilities

• Collaborate with cross-functional teams on server platform SI needs.
• Model, simulate and verify signal integrity for PCIe/DDR interfaces.
• Perform post-silicon validation and feedback to silicon derivation.
• Develop measurement plans and review results with leads.
• Create channel optimization models for board and package.
• Document results and best-known methods for reuse.
• Contribute to next-gen product methodologies and IP integration.
• Handle system-level power delivery network simulations for low-voltage/high-current.
• Coordinate with external IP providers to ensure performance.

Skills

Signal integrity

EM modeling

3-D modeling

SI verification

PCB/board design

High-speed I/O modeling

System-level simulation

Team collaboration

HVM experience

Education

Bachelor’s or Master’s in electrical engineering or computer engineering

Tools

ANSYS HFSS

ANSYS SIWAVE

Q3D

2.5-D modeling

DSO

VNA

ParBERT

TDR

HSPICE/ADS

Job description

AMD Penang is seeking a Signal Integrity Design Engineer to define and verify SI specifications across server products. You will model and simulate SI for die, package, and board levels, collaborating with IC Design, Layout, Packaging, and other teams.

The role emphasizes hands-on analysis, measurement planning, and delivering robust channel performance for high-speed interfaces. You will participate in the development of next-generation product methodologies and work in a hybrid environment in