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Celestica Malaysia in Penang is seeking a seasoned Engineer to lead build-to-print projects in supplier qualification, tooling qualification, and quality performance. You will coordinate NPIs (FAI/PPAP) and MVP initiatives, reviewing drawings and specs to propose design improvements.
The role requires hands-on experience with tooling design, plastics and sheet metal processes, and solid knowledge of GD&T, FMEA, and GR&R. Travel to overseas locations may be required as part of program management.
This position focuses on "build-to-print" commodities, with a primary focus on supplier qualification, tooling qualification, supplier quality performance, localization project management, First Article Inspection (FAI) and Material value proposition (MVP).
Consumer Electronics Manufacturing 1,001-5,000 employees
Headquartered in Toronto, Celestica Inc. is a global leader in high-reliability design, manufacturing, and supply chain solutions. We enable major brands to launch complex products in markets like Aerospace, Defense, HealthTech, and Industrial, driving a smarter, sustainable future.
In 2023, Celestica expanded its footprint with a new Design Centre in Penang, Malaysia. This strategic hub collaborates with our global engineering teams to develop cutting-edge Hardware Platform Solutions. The Penang team focuses on next-gen Networking, Storage, and Server technologies to power Cloud, AI, Machine Learning, Edge, and 5G deployments worldwide.
Headquartered in Toronto, Celestica Inc. is a global leader in high-reliability design, manufacturing, and supply chain solutions. We enable major brands to launch complex products in markets like Aerospace, Defense, HealthTech, and Industrial, driving a smarter, sustainable future.
In 2023, Celestica expanded its footprint with a new Design Centre in Penang, Malaysia. This strategic hub collaborates with our global engineering teams to develop cutting-edge Hardware Platform Solutions. The Penang team focuses on next-gen Networking, Storage, and Server technologies to power Cloud, AI, Machine Learning, Edge, and 5G deployments worldwide.