FA Engineer

STMicroelectronics; Muar; On-site; MYR 120,000 - 180,000; Full time

Job summary

STMicroelectronics seeks a Failure Analysis Engineer to perform IC failure analysis from electrical verification to physical root cause, and to drive corrective actions.

You will report to the Quality & Reliability teams, collaborate across Divisions, and prepare detailed FA reports. Strong technical knowledge and leadership are essential for cross-functional success and continuous improvement.

Qualifications

• Bachelor’s degree in Engineering or related field.
• Strong analytical and problem-solving abilities.
• Excellent communication and presentation skills.
• Knowledge of failure analysis techniques (polishing, imaging, EDX, IR/OBIRCH, TEM)

Responsibilities

• Perform IC failure analysis: electrical verification, fault isolation, physical root cause analysis.
• Prepare and publish failure analysis reports for stakeholders.
• Lead and present results in cross-functional meetings with Division, Field Quality Service, and Process teams.
• Review and improve 8D report content before approval.
• Compile customer complaint data for Quality Meetings and Management Reviews.
• Lead and coach technicians and operators to support failure analysis activities.
• Demonstrate high-performance behaviors and collaborate to achieve goals.

Skills

Analytical skills

Communication skills

Problem solving

Team leadership

Education

Engineering degree (Bachelors/Masters/PhD)

Job description

OUR STORY

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 122 nationalities, present in 40 countries, and comprising over 49,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

Summary

As a Failure Analysis Engineer, you will be responsible for performing and managing integrated circuit (IC) failure analysis activities, from electrical verification and fault isolation to physical root cause analysis. You will also support cross‑functional teams by communicating findings, driving corrective and preventive actions, and contributing to continuous improvement in quality and customer complaint handling.

YOUR ROLE

• Perform and manage IC failure analysis activities, including:
  • Electrical verification
  • Fault isolation
  • Physical root cause analysis
• Prepare and publish failure analysis reports to relevant stakeholders to support root cause investigation and the implementation of corrective and preventive actions.
• Participate in, lead, and present failure analysis results and status updates in cross‑functional meetings with Division, Field Quality Service, and Process teams.
• Review, validate, and improve 8D report content prepared by QA Engineers prior to approval, ensuring a high standard of report quality.
• Compile customer complaint data for Quality Meetings and Management Reviews.
• Lead and coach technicians and operators as needed to support failure analysis activities and project execution.
• Demonstrate high‑performance behaviors and collaborate effectively as part of a team to achieve project goals and operational excellence.

Your Skills & Experiences

• Bachelor’s, Master’s, or PhD degree in Engineering, preferably in Electronics, Manufacturing, Material Science, Chemical Engineering, or a related field.
• Strong analytical and problem‑solving skills.
• Excellent communication and presentation skills.
• Knowledge of failure analysis techniques, including:
  • Sample preparation: mechanical polishing, backside preparation, chemical decapsulation
  • Imaging: optical microscopy, SEM, FIB, plasma FIB, 2D/3D X‑ray
  • Material analysis: EDX, FTIR
  • Fault isolation: IR‑OBIRCH, TEM, EMMI
• Familiarity with systematic problem‑solving methodologies such as 8D and Ishikawa/Fishbone analysis.
• Ability to anticipate issues and challenges, and resolve them promptly and effectively.
• Good understanding of wafer fab, assembly, and testing processes.
• Ability to lead, coach, and collaborate with technicians and operators in a team‑oriented environment.

ST is proud to be one of the 17 companies certified as a 2026 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

To discover more, visit st.com/careers.