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Chipbond Technology Corporation in Penang, Malaysia, is seeking an Equipment Engineer to install, configure, and commission new equipment and systems for semiconductor production.
The role involves preventive and corrective maintenance, diagnosing equipment issues to minimize downtime, and collaborating with cross-functional teams to optimize performance. Fresh graduates encouraged to apply, with Mandarin and English proficiency required.
Install, configure, and commission new equipment and systems
Perform preventive and corrective maintenance on production equipment
Diagnose and troubleshoot equipment issues to minimize downtime
Collaborate with cross-functional teams to optimize equipment performance
Develop and implement equipment improvement plans
Maintain detailed records and documentation of equipment maintenance and repairs
Provide technical support and training to production staff on equipment operation
Bachelor's degree in electrical/Electronic Engineering or a related technical field.
At least 2 years of experience working as an Equipment Engineer in semiconductor environment; Experienced in managing machine related: sputter (PVD/PECVD) / Wafer Sort / Wafer Prober/ wafer sawing / taping / grinding / Laser marking/ Laser grooving/ Pick and Place/ Tape and Reel
The above positions require proficiency in Mandarin, English, as the position involves frequent coordination and reporting to the Taiwan headquarters and Mandarin-speaking clients.