ENGR I, MANUFACTURING EQUIP; MFG

Onsemi

Seremban

On-site

MYR 70,000 - 110,000

Full time

14 days+

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Job summary

onsemi in Malaysia is seeking an Engineering professional to support assembly equipment uptime and OEE, and to drive NPI readiness for new package and product development.

You will coordinate with Process, Product, Quality and Manufacturing teams, develop machine recipes and process parameters, and drive yield, cycle time and productivity improvements while maintaining engineering documentation and compliance.

Qualifications

Bachelor's degree in engineering required.
3–5 years of semiconductor assembly experience.
Experience with Die Attach, Wire Bond, Sintering, Molding or Singulation.
Familiar with SPC, FMEA, 8D and DOE methodologies.
Strong analytical and communication skills.

Responsibilities

Support assembly equipment uptime, OEE and maintenance programs.
Lead equipment qualification and readiness for NPI programs.
Coordinate with Process, Product, Quality and Manufacturing teams.
Develop machine recipes, tooling and process parameters.
Support DOE, process characterization and improvement projects.
Drive yield, cycle time and productivity improvements.
Maintain engineering documentation and compliance requirements.

Skills

Analytical skills

Communication skills

Education

Bachelor Degree in Engineering

Tools

Die Attach

Wire Bond

Sintering

Molding

Singulation

Job description

Responsible for supporting Assembly manufacturing equipment, driving equipment reliability and leading New Product Introduction (NPI) activities for new package and product development.

Responsibilities

Support assembly equipment uptime, OEE and maintenance programs.
Lead equipment qualification and readiness for NPI programs.
Coordinate with Process, Product, Quality and Manufacturing teams.
Develop machine recipes, tooling and process parameters.
Support DOE, process characterization and improvement projects.
Drive yield, cycle time and productivity improvements.
Maintain engineering documentation and compliance requirements.

Qualifications

Bachelor Degree in Engineering.
3–5 years semiconductor assembly experience.
Experience with Die Attach, Wire Bond, Sintering, Molding, Singulation or related equipment.
Familiar with SPC, FMEA, 8D and DOE methodologies.
Strong analytical and communication skills.

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Job Info