Thermo-Mechanical Simulation Engineer – Semiconductor Packaging

ON Semiconductor Malaysia Sdn. Bhd.

Seremban

On-site

MYR 90,000 - 130,000

Full time

14 days+

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Job summary

ON Semiconductor Malaysia Sdn. Bhd. seeks a Thermo-Mechanical Simulation Engineer to develop and execute simulation methodologies for semiconductor packages and power modules. You will work with design, package development, process reliability and manufacturing teams to accelerate product development and improve performance.

The role requires strong FEA skills, experience with ANSYS and Abaqus, and a collaborative mindset to translate simulations into design improvements.

Qualifications

  • Bachelor's, Master's or PhD in Mechanical/Materials/Physics or related field.
  • Experience with FEA tools: ANSYS Mechanical, ANSYS Icepak, Abaqus, COMSOL.
  • Knowledge of semiconductor packaging, power modules, thermal management and reliability.

Responsibilities

  • Perform thermo-mechanical simulations of semiconductor packages, power modules, and assemblies using FEA.
  • Develop models to evaluate thermal performance, stress, warpage, deformation and reliability risks.
  • Support material selection by assessing mechanical integrity and thermal behavior.
  • Conduct root-cause investigations and failure analysis via simulations.
  • Collaborate with design, process, reliability and manufacturing teams to optimize performance.
  • Document methods, report findings, and propose design improvements.
  • Support technology roadmaps and innovation projects related to advanced packaging.

Skills

Thermal analysis
Mechanical analysis
Reliability analysis
FEM
Cross-functional collaboration

Education

Bachelor's degree in Mechanical Engineering
Master's degree in related field

Tools

ANSYS Mechanical
ANSYS Icepak
Abaqus
COMSOL

Job description

ON Semiconductor Malaysia Sdn. Bhd. seeks a Thermo-Mechanical Simulation Engineer to develop and execute simulation methodologies for semiconductor packages and power modules. You will work with design, package development, process reliability and manufacturing teams to accelerate product development and improve performance.

The role requires strong FEA skills, experience with ANSYS and Abaqus, and a collaborative mindset to translate simulations into design improvements.

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