ENGR PRIN, EXTERNAL MANUFACTURING; MFG

ON Semiconductor; Selangor; On-site; MYR 90,000 - 130,000; Full time

Job summary

ON Semiconductor in Malaysia seeks an NPI Engineer (Assembly Packaging) to join our External Manufacturing team and drive our NPI/NPD portfolio, focusing on new tactical engagements essential for business growth. You will apply your technical network to enable new production introductions and shape manufacturing strategies, delivering practical packaging solutions.

The role requires hands-on experience with packaging technologies, cross-functional collaboration, and the ability to deliver

Job description

We are looking for a skilled NPI Engineer (Assembly Packaging) to join our External Manufacturing team to drive our growing NPI/ NPD portfolio, especially new tactical engagements critical for onsemi's business growth. In this role, you will leverage your strong expertise and extensive technical network to drive new production introduction, develop new capability requirements, shape manufacturing strategies, and deliver advanced solutions for next-generation silicon technology and packaging solutions.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.