External Manufacturing NPI Manager

onsemi

Malaysia

Hybrid

MYR 300,000 - 540,000

Full time

3 days ago

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Job summary

onsemi in Malaysia seeks a senior leader to own backend NPI from concept to production launch. You will drive PLM for new product commercialization and collaborate with internal and external teams to achieve on-time market releases.

You will mentor 10+ NPI/process engineers, guide wafer platforms like SiC/JFET/GaN/CIS, and partner with OSATs for qualification, BOM, risk analysis, and first part release.

Qualifications

Bachelor's degree in Engineering/Materials Science or equivalent technical background.
More than 10 years of experience in backend semiconductor IC manufacturing environment with in-depth assembly process expertise and shop floor experience.
Experience mentoring a highly technical team of 10+ NPI/process engineers.
Hands-on assembly process experience in wafer technologies such as SiC, JFET, GaN and CIS Imaging is highly desirable.
Prior experience in NPI, product/process integration and familiarity with CPI effects.
Experience in IC package design/CAD/simulation/characterization is advantageous.
Strong cross-functional collaboration, adaptable to matrix organization, solid engineering fundamentals (DOE/DOE characterization, SPC, failure analysis) and problem-solving skills.
Proficient in statistical analysis methods and data analytics.
Good communication skills in written and spoken English; Mandarin would be advantageous.

Responsibilities

Own backend external manufacturing NPI from conceptualization to production launch.
Provide functional leadership for NPI delivering PLM requirements for new product commercialization.
Manage team performance including delivery, planning, execution and daily operations.
Coordinate cross-functional engagements across BUs, Central Engineering, Operations, Quality, Supply Chain and Procurement.
Drive DFM and manufacturability readiness for new packages & complex derivatives.

Skills

Cross-functional Stakeholder Mgmt

IC Packaging & Assembly Process

New Product Introduction

Team Management

Education

Bachelor's degree in Engineering/Materials Science

Job description

Own backend external manufacturing NPI from conceptualization, development, qualification to production launch
Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
Responsible for the team’s performance, including overall delivery, tactical & resource planning, execution and day-to-day operationalization
Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives
Drive DFM, technology & manufacturability readiness for new package & complex derivative platformsfor effective POR freeze to new product industrialization
Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
Lead by example and adoption of data analytics and data-driven approach to problem solving and decision making
Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production

Qualifications

Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experienceStrong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings
Experience in leading and mentoring a highly technical and motivated team of 10+ NPI/ process engineers
Hands-on assembly process experience in leading wafer technology such as SiC, JFET, GaN and CIS Imaging is highly desirable
Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
Experience in IC package design/ CAD/ simulation/ characterization will be advantageous
Good overall understanding of OSAT business landscape, operations and industry trends
Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
Proficient in statistical analysis methods and familiar with data analytics
Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous

Required Skills

Cross-functional Stakeholder Management
IC Packaging & Assembly Process
New Product Introduction
Team Management

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Job Info