External Manufacturing NPI Manager

onsemi; Malaysia; Presencial; MYR 300.000 - 540.000; Jornada completa

Descripción de la vacante

onsemi in Malaysia seeks a senior leader to own backend NPI from concept to production launch. You will drive PLM for new product commercialization and collaborate with internal and external teams to achieve on-time market releases.

You will mentor 10+ NPI/process engineers, guide wafer platforms like SiC/JFET/GaN/CIS, and partner with OSATs for qualification, BOM, risk analysis, and first part release.

Formación

• Bachelor's degree in Engineering/Materials Science or equivalent technical background.
• More than 10 years of experience in backend semiconductor IC manufacturing environment with in-depth assembly process expertise and shop floor experience.
• Experience mentoring a highly technical team of 10+ NPI/process engineers.
• Hands-on assembly process experience in wafer technologies such as SiC, JFET, GaN and CIS Imaging is highly desirable.
• Prior experience in NPI, product/process integration and familiarity with CPI effects.
• Experience in IC package design/CAD/simulation/characterization is advantageous.
• Strong cross-functional collaboration, adaptable to matrix organization, solid engineering fundamentals (DOE/DOE characterization, SPC, failure analysis) and problem-solving skills.
• Proficient in statistical analysis methods and data analytics.
• Good communication skills in written and spoken English; Mandarin would be advantageous.

Responsabilidades

• Own backend external manufacturing NPI from conceptualization to production launch.
• Provide functional leadership for NPI delivering PLM requirements for new product commercialization.
• Manage team performance including delivery, planning, execution and daily operations.
• Coordinate cross-functional engagements across BUs, Central Engineering, Operations, Quality, Supply Chain and Procurement.
• Drive DFM and manufacturability readiness for new packages & complex derivatives.

Conocimientos

Cross-functional Stakeholder Mgmt

IC Packaging & Assembly Process

New Product Introduction

Team Management

Educación

Bachelor's degree in Engineering/Materials Science

Descripción del empleo

• Own backend external manufacturing NPI from conceptualization, development, qualification to production launch
• Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
• Responsible for the team’s performance, including overall delivery, tactical & resource planning, execution and day-to-day operationalization
• Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives
• Drive DFM, technology & manufacturability readiness for new package & complex derivative platformsfor effective POR freeze to new product industrialization
• Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
• Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
• Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
• Lead by example and adoption of data analytics and data-driven approach to problem solving and decision making
• Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production

Qualifications

• Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
• More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experienceStrong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings
• Experience in leading and mentoring a highly technical and motivated team of 10+ NPI/ process engineers
• Hands-on assembly process experience in leading wafer technology such as SiC, JFET, GaN and CIS Imaging is highly desirable
• Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
• Experience in IC package design/ CAD/ simulation/ characterization will be advantageous
• Good overall understanding of OSAT business landscape, operations and industry trends
• Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
• Proficient in statistical analysis methods and familiar with data analytics
• Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous

Required Skills

• Cross-functional Stakeholder Management
• IC Packaging & Assembly Process
• New Product Introduction
• Team Management

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Job Info

• Job Identification 2504720
• Job Category Engineering, Manufacturing
• Posting Date 03/09/2026, 10:31 PM
• Degree Level Bachelors
• Job Schedule Full time
• Job Shift Day
• Locations Lot 1.02, Level One, KPMG Tower, Petaling Jaya, 47800, MY

Lot 1.02, Level One, KPMG Tower, Petaling Jaya, 47800, MY