Senior Staff Engineer, Process Engineering (Plasma)

ams OSRAM

Kulim

Hybrid

MYR 180,000 - 240,000

Full time

3 days ago
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Job summary

ams OSRAM Opto Semiconductors seeks a skilled engineer to own front-end wafer fabrication processes (Dry Etch, PECVD, ALD) and drive process quality, yield, and stability KPIs. You will manage cross-functional projects, transfer ramps, and maintain comprehensive docs including FMEA and control plans.

You will also setup tools like SPC, FDC, SAP PM Scheduling, and CIM/EI, train junior staff, and collaborate across multicultural teams to improve cost and productivity.

Qualifications

  • Bachelor's degree in Engineering or Science required.
  • Master's/PhD considered an advantage.

Responsibilities

  • In charge of the front end wafer fabrication process in Dry Etch / PECVD / ALD fields.
  • Own quality, yield, damage containment, process capability and stability KPIs.
  • Lead process transfer ramp qualification projects; collaborate with cross-functional teams.
  • Create and maintain process/maintenance/operation documentation and FMEA/Control Plans.
  • Set up and maintain manufacturing/quality tools (SPC; FDC; SAP PM Scheduling; CIM/EI).
  • Provide training to junior engineers, technicians, manufacturing specialists.
  • Lead/participate in cross-functional projects to improve cost, yield, capacity and safety.

Skills

Front-end wafer fabrication
Cross-functional leadership
SPC, FDC, 8D problem solving, FMEA,DMA
DMAIC
Digital Manufacturing & Automation
English & Bahasa Malaysia fluency

Education

Bachelor's degree in Engineering/Science
Master's or PhD advantageous

Tools

SPC
FDC
SAP PM Scheduling
CIM/EI

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.


  • In charge of the elevant front end wafer fabrication process in Dry Etch / PECVD / ALD fields.
  • Full process ownership on quality, yield, damage containment, process capability and stability, cost, CpK and other related KPIs.
  • Lead process transfer ramp qualification projects, cooperate with cross-functional teams (Production, Process Integration, Process Development, Industrial Engineering, Production Planning, Quality Management, EHS, Facility Infrastructure & Hook-up, IT/CIM, Procurement, SCM, Project Management, Regensburg counterparts).
  • Create and maintain documentation (process/maintenance/operation/tool procurement/safety specification and procedures; FMEA; Control Plans; 8D lesson learnt etc)
  • Setup and maintain manufacturing/quality tools (SPC; FDC; SAP PM Scheduling; CIM/EI)
  • Provide training to junior engineers, technicians, manufacturing specialists.
  • Lead/participate in cross-functional projects (cost/yield/capacity/safety/productivity continuous improvement projects)

  • Candidate must have at least a Bachelor's Degree in Engineering or Science. Candidate with Master's Degree or PhD will have an added advantage.
  • 10 years of front-end semiconductor wafer fab working experience & competency in manufacturing, process engineering, product or process development
  • Experienced in leading cross-functional teams (process & equipment engineering, production)
  • Ability to work effectively in cross-cultural multi-national working environment & organization.
  • Experience with SPC, FDC, 8D problem solving, FMEA, DMAIC, TWI and Digital Manufacturing & Automation.
  • Fluent in English and Bahasa Malaysia.
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