Senior PCB Layout Engineer - High-Speed & Hybrid

Intel Corporation

Región Centro

Hybrid

MXN 450,000 - 750,000

Full time

2 days ago
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Job summary

Intel Corporation in Guadalajara is seeking an experienced PCB Layout Engineer to design high-quality PCBs, including flexible and rigid boards, using ECAD tools.

You will create layouts, detailed schematics, and fabrication drawings, define placement and routing rules, and collaborate with electrical, packaging, thermal, and manufacturing teams to deliver reliable, cost-effective boards that meet performance goals.

Qualifications

  • Bachelor's degree in Electrical Engineering, Computer Engineering, or related field.
  • 3+ years of hands-on PCB layout design experience.
  • Proficiency in ECAD tools, preferably Allegro Cadence Suite.
  • Experience with high-speed, high-density, mixed-signal, RF designs.
  • Advanced English level.

Responsibilities

  • Create and deliver PCB layouts for high-speed, high-density designs.
  • Prepare detailed schematics, drawings, and fabrication assemblies.
  • Define placement and routing rules to optimize performance.
  • Manage feasibility studies and tapeout processes end-to-end.
  • Collaborate with electrical design, packaging, thermal, and manufacturing teams.
  • Provide guidance on fabrication capabilities and cost-effective production.

Skills

PCB layout design
ECAD tools (Allegro Cadence Suite)
High-speed/high-density designs
PCB design flow
PCB fabrication documentation
Advanced English

Education

Bachelor's degree in Electrical or Computer Engineering or related field
Master's degree in Electrical/Computer Engineering or related field
PhD in a relevant field (plus)

Tools

Allegro Cadence Suite

Job description

Intel Corporation in Guadalajara is seeking an experienced PCB Layout Engineer to design high-quality PCBs, including flexible and rigid boards, using ECAD tools.

You will create layouts, detailed schematics, and fabrication drawings, define placement and routing rules, and collaborate with electrical, packaging, thermal, and manufacturing teams to deliver reliable, cost-effective boards that meet performance goals.

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