Signal Integrity Engineer

microTECH Global Limited; Italia; In loco; EUR 60.000 - 75.000; Tempo pieno

Vantaggi offerti da questo lavoro

Training and career development opportunities

Discretionary annual bonus

Work in a high-impact R&D environment

Descrizione del lavoro

microTECH Global Limited is seeking a High Speed Signal Integrity Engineer based in Milan, Italy. The successful candidate will have ownership of signal integrity across the design stack and will drive methodologies for high-performance hardware design.

The role requires a strong academic foundation, 5+ years of industry experience, and solid understanding of signal integrity fundamentals. The compensation package ranges from €60,000 to €75,000, with opportunities for growth and development.

Competenze

• 5+ years of industry experience in signal integrity or related fields.
• Understanding of interconnect modelling and electromagnetic theory.
• Experience with automation pipelines, preferably using Python.

Mansioni

• Own signal integrity analysis for high-speed channels.
• Optimise PCB, package, and interconnect performance.
• Develop engineering tools and automated workflows.

Conoscenze

Signal integrity fundamentals

Simulation tools (HFSS, ADS, etc.)

Electrical Engineering fundamentals

Communication skills in English

Software engineering mindset

Formazione

Advanced degree in Electrical Engineering, Physics, or related field

Strumenti

HFSS

ADS

CST

COMSOL

SIwave

Descrizione del lavoro

ROLE: High Speed Signal Integrity Engineer

LOCATION: Milan, Italy

About the Role

We are working with a leading international R&D organisation at the forefront of next-generation ICT hardware systems. Their advanced engineering team focuses on cutting-edge hardware technologies, with particular strength in high-speed interconnects, signal integrity (SI), and system-level performance optimisation.

This is an opportunity to take real ownership of signal integrity across the full design stack — from individual interconnects to complete system channels — while shaping the methodologies, tools, and workflows that enable high-performance, scalable hardware design.

What You’ll Do

In this role, you will:

• Own end-to-end signal integrity analysis for high-speed channels, from early design through to validation
• Optimise PCB, package, and interconnect performance under real-world operating conditions
• Develop and maintain engineering tools, scripts, and automated workflows to improve team efficiency and reproducibility
• Build reusable electromagnetic modelling methodologies tailored to high-speed applications
• Translate SI analysis into clear, actionable design guidelines that influence hardware development decisions
• Contribute to and shape the technical roadmap for high-speed interconnects, integrating insights from industry and research

What We’re Looking For

We’re seeking engineers with strong fundamentals and a track record of delivering high-quality technical work.

You will typically bring:

• A strong academic foundation in Electrical Engineering, Physics, or a related field, supported by an advanced degree and/or 5+ years of industry experience
• Solid understanding of signal integrity fundamentals, including:
  • Interconnect modelling
  • Electromagnetic (EM) theory
  • Channel metrics (eye diagrams, crosstalk, BER, TDR)
• Hands‑on experience with simulation tools such as HFSS, ADS, CST, COMSOL, SIwave (or similar), with the ability to assess result accuracy and identify numerical artefacts
• A software engineering mindset, with experience building tools or automation pipelines (e.g. Python), beyond ad-hoc scripting
• Strong communication skills in English, including technical reporting and cross‑functional collaboration

We also welcome candidates from adjacent domains (EM, RF, packaging, photonics, numerical modelling) who are motivated to specialise in signal integrity.

Nice to Have

• Experience delivering SI results on real high-speed hardware systems
• Knowledge of high-speed interfaces (PCIe, Ethernet, DDR, SerDes)
• Exposure to statistical SI techniques (Monte Carlo, corner analysis, DoE)
• Background in advanced packaging or chip-package co‑design
• Experience with model order reduction, surrogate modelling, or ML applied to EM/SI problems

What’s on Offer

• Opportunity to work in a high-impact R&D environment on next‑generation technologies
• A collaborative, technically driven team with strong growth potential
• Competitive compensation package:
  • €60,000 – €75,000 base salary (depending on experience)
  • Discretionary annual bonus (up to 2 months’ salary)
• Ongoing training and career development opportunities across Europe and internationally
• Employment under CCNL Telecommunications (Levels 6–7)

Diversity & Inclusion

Our client is committed to building an inclusive workplace and welcomes applications from all qualified candidates, regardless of background.