Senior Non-Destructive Analysis Specialist – SiC/GaN Focus

Vishay Intertechnology; Sicilia; Hybrid; EUR 90,000 - 110,000; Full time

Job summary

Vishay Intertechnology in Italy seeks a Senior Laboratory Specialist – Advanced Non-Destructive Analysis to lead state-of-the-art failure analysis for SiC and GaN power devices. You will perform SAM, 2D/3D X-Ray inspections and advanced fault isolation, collaborating across R&D and manufacturing in an international environment.

The role focuses on supporting R&D for power package development, with strong emphasis on cross-functional teamwork and precise analytical investigations.

Qualifications

• More than 20 years of experience in semiconductor analytical laboratories.
• Extensive expertise in SAM analysis, 2D X-Ray inspection, and 3D X-Ray inspection.
• Strong knowledge of advanced fault isolation techniques including Thermos, PHEMOS and OBIRCH.
• Experience with chemical lab activities and acid etching processes.
• Solid understanding of semiconductor package structures, SiC and GaN technologies.

Responsibilities

• Perform advanced non-destructive analysis on semiconductor devices and power modules.
• Support R&D activities related to power package and module development for SiC and GaN technologies.
• Execute SAM inspections and interpret complex defect signatures.
• Perform 2D and 3D X-Ray inspections for package and assembly analysis.
• Support defect localization and analytical investigations on devices and power modules.
• Collaborate with R&D, manufacturing, reliability and quality teams during investigations.
• Contribute to laboratory process optimization and continuous improvement activities.

Skills

SAM analysis

2D X-Ray inspection

3D X-Ray inspection

Thermos

PHEMOS

OBIRCH

Education

Technical diploma or degree in a relevant technical field

Job description

Vishay Intertechnology in Italy seeks a Senior Laboratory Specialist – Advanced Non-Destructive Analysis to lead state-of-the-art failure analysis for SiC and GaN power devices. You will perform SAM, 2D/3D X-Ray inspections and advanced fault isolation, collaborating across R&D and manufacturing in an international environment.

The role focuses on supporting R&D for power package development, with strong emphasis on cross-functional teamwork and precise analytical investigations.