Senior Lab Expert: Physical & Failure Analysis (SiC/GaN)

Vishay Israel; Sicilia; On-site; EUR 90,000 - 130,000; Full time

Benefits offered by this job

Health care coverage

Career development opportunities

Global work exposure

Job summary

Vishay Italy seeks a highly experienced Laboratory Expert in Physical Analysis & Failure Analysis to support advanced analysis for power semiconductor devices and modules. You will drive R&D activities for SiC and GaN packaging, perform root-cause investigations, and lead microscopy, SEM/FIB analyses, and chemical etching to characterize complex multilayer structures.

The role requires deep knowledge of Si/SiC/GaN device structures, packaging technologies, and reliability practices, with

Qualifications

• More than 20 years of experience in semiconductor failure analysis and physical analysis laboratories.
• Technical diploma or degree in a relevant technical field.
• Extensive hands-on experience with semiconductor sample preparation techniques, including: metallographic preparation, lapping and polishing, precision cutting, ion milling, sputtering.
• Strong experience with: optical microscopy, digital microscopy, SEM analysis, FIB analysis.
• Extensive experience with chemical and acid etching techniques for semiconductor analysis.
• Deep knowledge of: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN) device structures.
• Strong understanding of power semiconductor packaging technologies and power module architectures.
• Deep knowledge of multilayer and multi-interface structures used in power electronics packaging.
• Strong understanding of semiconductor failure mechanisms and physical analysis methodologies.
• Strong laboratory hands‑on attitude and ability to independently manage complex analytical activities.
• Experience in automotive and industrial power electronics applications.
• Familiarity with reliability and qualification activities.
• Strong technical problem‑solving capability.
• Ability to work in cross‑functional and international environments.
• Senior‑level laboratory expertise with strong practical and technical background.

Responsibilities

• Support advanced physical analysis and failure analysis activities on power semiconductor devices and power modules.
• Support R&D activities for package and power module development focused on SiC and GaN technologies.
• Perform complex root cause investigations related to material, assembly, interface, and structural issues.
• Execute advanced semiconductor sample preparation activities, including: precision cutting and sectioning, lapping and polishing, metallographic cross-sections, ion milling, sputtering/coating processes.
• Perform advanced optical and digital microscopy investigations.
• Conduct SEM and FIB analyses for defect localization and structural characterization.
• Execute chemical etching and acid-based processes for resin removal, delayering, and metallization exposure.
• Analyze multilayer and multi-interface package structures used in power modules and semiconductor power devices.
• Support reliability investigations and technology characterization activities.
• Collaborate closely with R&D, process engineering, manufacturing, and quality teams.
• Contribute to the development of laboratory methodologies and analytical best practices.
• Mentor junior laboratory personnel and support technical knowledge transfer.

Skills

Senior-level lab expertise

Semiconductor failure analysis

Physical analysis

SiC technology

GaN technology

Cross-functional collaboration

Automotive power electronics

Industrial power electronics

Education

Technical diploma or degree in a technical field

Tools

Optical microscopy

Digital microscopy

SEM

FIB

Ion milling

Metallographic preparation

Lapping and polishing

Precision cutting

Sputtering

Acid etching

Job description

Vishay Italy seeks a highly experienced Laboratory Expert in Physical Analysis & Failure Analysis to support advanced analysis for power semiconductor devices and modules. You will drive R&D activities for SiC and GaN packaging, perform root-cause investigations, and lead microscopy, SEM/FIB analyses, and chemical etching to characterize complex multilayer structures.

The role requires deep knowledge of Si/SiC/GaN device structures, packaging technologies, and reliability practices, with