R&D – Head of Embedded NVM Technologies

JR Italy; Verona; In loco; EUR 90.000 - 150.000; Tempo pieno

Descrizione del lavoro

An established industry player is seeking a Head of Embedded NVM Technologies to lead innovative projects in semiconductor technology. This pivotal role involves integrating advanced eNVM features into cutting-edge platforms while managing cross-functional teams across diverse geographies. Candidates should possess a strong background in CMOS device physics and a proven track record in delivering technologies into high-volume production. The position offers a unique opportunity to influence the future of embedded memory technologies while fostering strong relationships with clients and stakeholders. Relocation to India is required post-FAB construction, making this a truly global role.

Competenze

• MS or PhD in Electrical Engineering or Materials Science required.
• 15+ years in the semiconductor industry with leadership experience.

Mansioni

• Integrate eNVM features into platform technologies and manage projects.
• Lead cross-functional teams and build customer relationships.

Conoscenze

CMOS device physics

eNVM technologies

project management

cross-functional team leadership

analytical techniques

Formazione

MS in Electrical Engineering

PhD in Materials Science

Descrizione del lavoro

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R&D – Head of Embedded NVM Technologies, Verona

Client: Theron Solutions

Location: Verona, Italy

Job Category: Other

EU work permit required: Yes

Job Reference: 428703351644671180833715

Job Views: 2

Posted: 26.04.2025

Expiry Date: 10.06.2025

Job Description:

Note: This role requires relocation to Dholera, India, once the FAB is built.

Responsibilities:

1. Integrate eNVM (embedded Non-Volatile Memory) features into 28nm platform technologies, including MTP and Flash, collaborating with IP providers as needed.
2. Design and layout of test chips for device/technology optimization, reliability assessment, and SPICE model extraction.
3. Manage projects from justification to qualification and yield ramp, ensuring performance, quality, schedule, and cost targets are met.
4. Lead a cross-functional team across diverse geographies.
5. Build strong customer relationships based on technical confidence.
6. Conduct competitor benchmarking and own the technology roadmap.
7. Present to internal and customer senior executives.
8. Potential involvement in OTP development.
9. Travel occasionally (few weeks per quarter).

Qualifications:

• MS or PhD in Electrical Engineering, Materials Science, or equivalent.
• Strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, and analytical techniques.
• Deep knowledge of key eNVM technologies (charge trap, floating gate, RRAM, MRAM, etc.) and related parameters.
• Experience in delivering these technologies into volume manufacturing.
• Proven leadership in cross-functional teams and project management within timelines and budgets.
• Ability to work across cultures and geographies.

Desired Experience Level:

• 15+ years in the semiconductor industry.
• Successful track record of developing technologies into high-volume production.
• Strong problem-solving skills with design of experiments and analytical tools.

EOE Statement: Our client is an Equal Opportunity Employer committed to a work environment free of discrimination and harassment, adhering to all applicable laws and regulations.