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R&D – Head of Embedded NVM Technologies

JR Italy

Vercelli

In loco

EUR 80.000 - 150.000

Tempo pieno

4 giorni fa
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Descrizione del lavoro

An established industry player is seeking a Head of Embedded NVM Technologies to lead innovative projects in the semiconductor sector. This role requires a visionary leader with over 15 years of experience in eNVM technologies and a proven track record in driving projects from conception to high-volume production. You will manage cross-functional teams, build strong customer relationships, and present to senior executives. This position offers the opportunity to work in a dynamic environment where your contributions will shape the future of technology. If you are passionate about innovation and leadership, this role is perfect for you.

Competenze

  • 15+ years in the semiconductor industry with a focus on eNVM technologies.
  • Strong understanding of CMOS and eNVM device physics.

Mansioni

  • Lead integration of eNVM features into platform technologies.
  • Manage end-to-end project from justification to qualification.
  • Build and lead cross-functional teams across geographies.

Conoscenze

Leadership
Project Management
Cross-Functional Team Leadership
Problem-Solving
Analytical Techniques

Formazione

M.S or PhD in Electrical Engineering
M.S or PhD in Materials Science

Descrizione del lavoro

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R&D – Head of Embedded NVM Technologies, Vercelli

Client: Theron Solutions

Location: Vercelli, Italy

Job Category: Other

EU work permit required: Yes

Job Reference:

4287033516446711808337169

Job Views:

2

Posted:

26.04.2025

Expiry Date:

10.06.2025

Job Description:

THIS ROLE REQUIRES A RELOCATION TO DHOLERA, INDIA once the FAB is built.

Responsibilities:

  1. Integration responsibilities to add eNVM (embedded Non Volatile Memory) features to 28 110nm platform technologies including MTP and Flash. Work with IP providers, as needed, to implement these features.
  2. Design and layout of test chips to aid in device/technology optimization, reliability assessment, and SPICE model extraction.
  3. End-to-end project management from initial project justification to final qualification and yield ramp, with responsibilities for achieving desired performance, quality/yield, schedule, and cost targets.
  4. Build and lead a cross-functional team across diverse geographies.
  5. Build strong customer relationships based on confidence in the company's technical capabilities.
  6. Conduct competitor benchmarking; own the technology roadmap.
  7. Present to internal and customer senior executives.
  8. Possible involvement in OTP development.
  9. Travel (few weeks per quarter).

Additional qualities:

  • Ability to manage, mentor, and lead a team of highly motivated professionals.
  • Able to work independently, self-motivated with a strong drive to succeed.
  • Team player with the ability to work across diverse cross-functional teams worldwide.
  • Leadership skills to influence all organizational levels.
  • Inclusive, adaptable to various situations and global norms.
  • Curious and resilient learner, seeking data to build understanding.
  • Collaborative, building relationships and supporting others.
  • Innovative and creative, proactively exploring new ideas and adapting quickly to change.

Qualifications:

  1. M.S or PhD in Electrical Engineering, Materials Science, or equivalent.
  2. Strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, analytical techniques (physical and electrical).
  3. Deep understanding of key eNVM technologies (charge trap, floating gate, RRAM, MRAM, etc.).
  4. Understanding of technology parameters and figures of merit (bit cell size, macro size, endurance, retention, power, latency, mask count, etc.); experience in achieving competitive performance.
  5. Proven track record in delivering these technologies into volume manufacturing.
  6. Ability to lead cross-functional teams and achieve project completion within timeline and budget.
  7. Ability to work across different cultures and geographies.
  8. Good team player.
  9. Innovation and competitive mindset.

Desired Experience Level:

  1. 15+ years of experience in the semiconductor industry.
  2. Proven track record of successfully developing new technologies into high-volume production.
  3. Proven problem-solving skills using design of experiments and analytical tools.

EOE:

Our client is an Equal Opportunity Employer and prohibits discrimination and harassment of any kind. We are committed to providing a work environment free of discrimination, where employment decisions are based on business needs, job requirements, and individual qualifications. We do not discriminate based on race, color, religion, sex, age, disability, sexual orientation, gender identity, marital status, military service, family medical history, genetic information, or any other protected characteristic.

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