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R&D – Head Of Embedded Nvm Technologies

Buscojobs

Veneto

In loco

EUR 90.000 - 150.000

Tempo pieno

Oggi
Candidati tra i primi

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Descrizione del lavoro

An established industry player is seeking a Senior Role in Semiconductor Technology. This pivotal position involves integrating advanced eNVM features into cutting-edge semiconductor platforms and leading cross-functional teams to ensure project success. With a focus on innovation and collaboration, you will develop strong customer relationships while managing projects from inception to volume manufacturing. This role offers an exciting opportunity to make a significant impact in the semiconductor industry, working with global teams and driving technology advancements. If you are a seasoned professional with a passion for technology and leadership, this is the opportunity for you.

Competenze

  • Deep understanding of CMOS and eNVM device physics.
  • Proven experience in bringing technologies into volume manufacturing.

Mansioni

  • Integrate eNVM features into semiconductor technologies.
  • Manage projects ensuring performance, quality, and cost targets.
  • Lead cross-functional teams across different geographies.

Conoscenze

Leadership Skills
Team Collaboration
Problem-Solving
Communication Skills
Project Management

Formazione

MS or PhD in Electrical Engineering
Materials Science or related field

Descrizione del lavoro

Job Opportunity: Senior Role in Semiconductor Technology

This role requires relocation to Dholera, India once the fabrication plant (FAB) is built.

Responsibilities:
  1. Integrate eNVM (embedded Non-Volatile Memory) features into 28nm 110nm platform technologies, including MTP and Flash, working with IP providers as needed.
  2. Design and layout of test chips to support device/technology optimization, reliability assessment, and SPICE model extraction.
  3. Manage projects from initial justification through qualification and yield ramp, ensuring performance, quality, schedule, and cost targets are met.
  4. Lead and build a cross-functional team across different geographies.
  5. Develop strong customer relationships based on technical confidence.
  6. Conduct competitor benchmarking and own the technology roadmap.
  7. Present to internal teams and senior customer executives.
  8. Potential involvement in OTP development.
  9. Travel occasionally (few weeks per quarter).
Essential Attributes:
  • Leadership skills to manage, mentor, and motivate professionals.
  • Ability to work independently and proactively.
  • Strong team collaboration across global teams.
  • Influence at all organizational levels.
  • Inclusive and adaptable communication style.
  • Curious, resilient, and data-driven problem-solving approach.
  • Supportive and collaborative relationship-building.
  • Innovative mindset with adaptability to change.
Qualifications:
  • MS or PhD in Electrical Engineering, Materials Science, or related field.
  • Deep understanding of CMOS and eNVM device physics, process modules, and yield improvement techniques.
  • Knowledge of key eNVM technologies such as charge trap, floating gate, RRAM, MRAM, etc.
  • Familiarity with technology parameters and performance metrics.
  • Proven experience in bringing technologies into volume manufacturing.
  • Leadership in cross-functional project management.
  • Ability to work effectively across cultures and geographies.
  • Strong team player with innovative and competitive mindset.
Desired Experience:
  • 15+ years in the semiconductor industry.
  • Successful track record of developing high-volume production technologies.
  • Excellent problem-solving skills using experimental design and analytical tools.

Our client is an Equal Opportunity Employer committed to a discrimination-free workplace, ensuring all employment decisions are based on merit and qualifications.

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