R&D – Head of Embedded NVM Technologies

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R&D – Head of Embedded NVM Technologies, Rimini

Client: Theron Solutions

Location: Rimini, Italy

Job Category: Other

EU work permit required: Yes

Job Reference: 4287033516446711808337130

Job Views: 2

Posted: 26.04.2025

Expiry Date: 10.06.2025

Job Description:

THIS ROLE REQUIRES A RELOCATION TO DHOLERA, INDIA once the FAB is built.

Responsibilities:

1. Integration responsibilities to add eNVM (embedded Non Volatile Memory) features to 28 110nm platform technologies including MTP and Flash. Work with IP providers to implement these features.
2. Design and layout of test chips to aid in device/technology optimization, reliability assessment, and SPICE model extraction.
3. End-to-end project management from initial justification to qualification and yield ramp, ensuring performance, quality, schedule, and cost targets are met.
4. Build and lead a cross-functional team across diverse geographies.
5. Build strong customer relationships based on confidence in the company's technical capabilities.
6. Conduct competitor benchmarking; own the technology roadmap.
7. Present to internal and customer senior executives.
8. Possible involvement in OTP development.
9. Travel few weeks per quarter.

Additional qualities:

• Ability to manage, mentor, and lead a team of motivated professionals.
• Work independently, self-motivated, driven to succeed.
• Team player with ability to collaborate across diverse teams worldwide.
• Leadership skills to influence all organizational levels.
• Inclusive, adaptable to various cultural norms.
• Curious, resilient, data-driven problem solver.
• Collaborative, relationship builder, supportive, open-minded.
• Innovative, proactive in exploring new ideas, adaptable to change.

Qualifications:

1. M.S or PhD in Electrical Engineering, Materials Science, or equivalent.
2. Strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, analytical techniques.
3. Deep understanding of eNVM technologies (charge trap, floating gate, RRAM, MRAM, etc.).
4. Knowledge of key parameters and figures of merit; experience in achieving competitive performance.
5. Proven track record in delivering technologies into volume manufacturing.
6. Leadership in cross-functional teams to meet project timelines and budgets.
7. Experience working across cultures and geographies.
8. Good team player.
9. Innovative and competitive mindset.

Desired Experience Level:

1. 15+ years in the semiconductor industry.
2. Successful development of new technologies into high-volume production.
3. Strong problem-solving skills using design of experiments and analytical tools.

EOE:

Our client is an Equal Opportunity Employer committed to a discrimination-free work environment, making employment decisions based on business needs and individual qualifications without regard to protected characteristics.