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R&D – Head of Embedded NVM Technologies

JR Italy

Mantova

In loco

EUR 80.000 - 150.000

Tempo pieno

2 giorni fa
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Descrizione del lavoro

An established industry player is seeking a Head of Embedded NVM Technologies to lead innovative projects in semiconductor technology. This pivotal role involves overseeing the integration of cutting-edge eNVM features into advanced platforms, ensuring high performance and quality standards. The successful candidate will manage cross-functional teams, build strong customer relationships, and drive technology roadmaps. With a strong emphasis on innovation and collaboration, this position offers an exciting opportunity to make a significant impact in the semiconductor field, particularly as the company expands its operations internationally.

Competenze

  • 15+ years in semiconductor industry with a focus on eNVM technologies.
  • Strong leadership and project management skills required.

Mansioni

  • Lead integration of eNVM features into platform technologies.
  • Manage end-to-end project from justification to qualification.
  • Build and lead a cross-functional team across diverse geographies.

Conoscenze

CMOS Understanding
eNVM Device Physics
Project Management
Analytical Techniques
Cross-Functional Team Leadership
Problem-Solving Skills

Formazione

M.S. or PhD in Electrical Engineering
Equivalent in Materials Science

Descrizione del lavoro

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R&D – Head of Embedded NVM Technologies, Mantova

Client: Theron Solutions

Location: Mantova, Italy

Job Category: Other

EU work permit required: Yes

Job Reference:

4287033516446711808337124

Job Views:

2

Posted:

26.04.2025

Expiry Date:

10.06.2025

Job Description:

THIS ROLE REQUIRES A RELOCATION TO DHOLERA, INDIA once the FAB is built.

Responsibilities:

  1. Integration responsibilities to add eNVM (embedded Non Volatile Memory) features to 28 110nm platform technologies including MTP and Flash. Work with IP providers to implement these features.
  2. Design and layout of test chips to aid in device/technology optimization, reliability assessment, and SPICE model extraction.
  3. End-to-end project management from initial justification to final qualification and yield ramp, ensuring performance, quality/yield, schedule, and cost targets.
  4. Build and lead a cross-functional team across diverse geographies.
  5. Build strong customer relationships based on confidence in the company's technical capabilities.
  6. Conduct competitor benchmarking; own the technology roadmap.
  7. Present to internal and customer senior executives.
  8. Possible involvement in OTP development.
  9. Travel (few weeks per quarter).

Qualifications:

  1. M.S. or PhD in Electrical Engineering, Materials Science, or equivalent.
  2. Strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, and analytical techniques.
  3. Deep understanding of key eNVM technologies (charge trap, floating gate, RRAM, MRAM, etc.).
  4. Understanding of technology parameters and figures of merit (bit cell size, macro size, endurance, retention, power, latency, mask count, etc.); experience in achieving competitive performance.
  5. Proven track record in delivering these technologies into volume manufacturing.
  6. Ability to lead cross-functional teams and achieve project completion within timeline and cost targets.
  7. Ability to work across different cultures and geographies.
  8. Good team player.
  9. Innovation and competitive mindset.

Desired Experience Level:

  1. 15+ years of experience in the semiconductor industry.
  2. Proven track record of successfully developing new technologies into high-volume production.
  3. Proven problem-solving skills using design of experiments and analytical tools.

EOE: Our client is an Equal Opportunity Employer and prohibits discrimination and harassment of any kind. We are committed to providing a work environment free of discrimination and harassment. Employment decisions are based on business needs, job requirements, and individual qualifications, without regard to race, color, religion, sex, age, disability, sexual orientation, gender identity, marital status, military service, family medical history, or any other protected characteristic.

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