R&D – Head of Embedded NVM Technologies

JR Italy; Lecco; In loco; EUR 80.000 - 150.000; Tempo pieno

Descrizione del lavoro

An established industry player is seeking a Head of Embedded NVM Technologies to lead innovative projects in the semiconductor sector. This pivotal role involves managing the integration of advanced memory technologies and overseeing cross-functional teams to ensure successful project delivery. The ideal candidate will possess extensive experience in semiconductor manufacturing and a strong background in electrical engineering or materials science. Join a forward-thinking company committed to excellence and innovation, where your leadership will shape the future of embedded memory technologies. Relocation to Dholera, India, is required once the facility is operational.

Competenze

• 15+ years in semiconductor industry with a focus on eNVM technologies.
• Strong understanding of CMOS and eNVM device physics.

Mansioni

• Lead integration of eNVM features into platform technologies.
• Manage end-to-end project timelines and deliverables.
• Build and lead cross-functional teams across geographies.

Conoscenze

Team Management

Project Management

Cross-Functional Team Leadership

Customer Relationship Building

Analytical Problem Solving

Formazione

M.S or PhD in Electrical Engineering

M.S or PhD in Materials Science

Descrizione del lavoro

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R&D – Head of Embedded NVM Technologies, Lecco

Client: Theron Solutions

Location: Lecco, Italy (relocation to Dholera, India required once the FAB is built)

Job Category: Other

EU work permit required: Yes

Job Reference:

4287033516446711808337154

Job Views:

2

Posted:

26.04.2025

Expiry Date:

10.06.2025

Job Description:

THIS ROLE REQUIRES A RELOCATION TO DHOLERA, INDIA once the FAB is built.

Responsibilities:

1. Integration responsibilities to add eNVM (embedded Non Volatile Memory) features to 28 nm 110nm platform technologies including MTP and Flash. Work with IP providers, as needed, to implement these features.
2. Design and layout of test chips to aid in device/technology optimization, reliability assessment, and SPICE model extraction.
3. End-to-end project management from initial justification to final qualification and yield ramp, with responsibilities for achieving performance, quality/yield, schedule, and cost targets.
4. Build and lead a cross-functional team across diverse geographies.
5. Build strong customer relationships based on confidence in the company's technical capabilities.
6. Conduct competitor benchmarking; own the technology roadmap.
7. Present to internal and customer senior executives.
8. Possible involvement in OTP development.
9. Travel (few weeks per quarter).

Qualities and skills:

• Ability to manage, mentor, and lead a team of highly motivated professionals.
• Ability to work independently, self-motivated with a strong drive to win.
• Team player with the ability to work across diverse cross-functional teams worldwide.
• Leadership skills to influence all organizational levels.
• Inclusive, adaptable to various global norms.
• Curious and resilient learner, data-driven in understanding challenges.
• Collaborative, relationship-builder, supportive, and open-minded.
• Innovative, proactive in exploring new ideas, adaptable to change.

Qualifications:

• M.S or PhD in Electrical Engineering, Materials Science, or equivalent.
• Strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, and analytical techniques.
• Deep understanding of key eNVM technologies (charge trap, floating gate, RRAM, MRAM, etc.).
• Knowledge of technology parameters and figures of merit (bit cell size, macro size, endurance, retention, power, latency, mask count, etc.) and experience in achieving competitive performance.
• Proven track record in delivering these technologies into volume manufacturing.
• Ability to lead cross-functional teams and meet project timelines and budgets.
• Ability to work across cultures and geographies.
• Good team player.
• Innovative and competitive mindset.

Desired Experience Level:

• 15+ years of experience in the semiconductor industry.
• Proven success in developing new technologies into high-volume production.
• Strong problem-solving skills using design of experiments and analytical tools.

EOE:

Our client is an Equal Opportunity Employer committed to a work environment free of discrimination and harassment. Employment decisions are based on business needs, job requirements, and individual qualifications, without regard to race, color, religion, sex, age, disability, or other protected characteristics.