R&D – Head of Embedded NVM Technologies

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R&D – Head of Embedded NVM Technologies, La Spezia

Client: Theron Solutions

Location: La Spezia, Italy

Job Category: Other

EU work permit required: Yes

Job Reference: 4287033516446711808337150

Job Views: 2

Posted: 26.04.2025

Expiry Date: 10.06.2025

Job Description:

THIS ROLE REQUIRES A RELOCATION TO DHOLERA, INDIA once the FAB is built.

Responsibilities:

1. Integration responsibilities to add eNVM (embedded Non-Volatile Memory) features to 28nm 110nm platform technologies including MTP and Flash. Work with IP providers to implement these features.
2. Design and layout of test chips to aid in device/technology optimization, reliability assessment, and SPICE model extraction.
3. End-to-end project management from initial justification to final qualification and yield ramp, ensuring performance, quality, schedule, and cost targets are met.
4. Build and lead a cross-functional team across diverse geographies.
5. Build strong customer relationships based on confidence in the company's technical capabilities.
6. Conduct competitor benchmarking; own the technology roadmap.
7. Present to internal and customer senior executives.
8. Possible involvement in OTP development.
9. Travel occasionally (few weeks per quarter).

Required skills and attributes include the ability to manage and lead teams, work independently, collaborate across cultures, influence organizational levels, adapt to diverse norms, approach challenges with curiosity and resilience, and be innovative and proactive.

Qualifications:

1. M.S. or PhD in Electrical Engineering, Materials Science, or equivalent.
2. Strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, and analytical techniques.
3. Deep understanding of key eNVM technologies such as charge trap, floating gate, RRAM, MRAM.
4. Knowledge of technology parameters and figures of merit like bit cell size, macro size, endurance, retention, power, latency, mask count, etc., with experience in achieving competitive performance.
5. Proven track record in delivering these technologies into volume manufacturing.
6. Ability to lead cross-functional teams and complete projects within timelines and budgets.
7. Experience working across different cultures and geographies.
8. Good team player with an innovative and competitive mindset.

Desired Experience Level:

1. 15+ years in the semiconductor industry.
2. Successful experience developing new technologies into high-volume production.
3. Strong problem-solving skills using design of experiments and analytical tools.

EOE: Our client is an Equal Opportunity Employer and prohibits discrimination and harassment of any kind. Employment decisions are based on business needs, job requirements, and individual qualifications, without regard to race, color, religion, sex, age, disability, sexual orientation, gender identity, marital status, military service, family medical history, genetic information, or any other protected characteristic.