R&D – Head of Embedded NVM Technologies

JR Italy; Firenze; In loco; EUR 80.000 - 150.000; Tempo pieno

Descrizione del lavoro

An innovative firm is seeking a Head of Embedded NVM Technologies to lead the integration of cutting-edge eNVM features into advanced semiconductor platforms. This pivotal role involves managing complex projects, fostering cross-functional collaboration, and ensuring successful technology transfer into high-volume production. The ideal candidate will possess extensive experience in the semiconductor industry, a strong technical background in device physics, and a proven track record of delivering innovative solutions. This role offers the opportunity to make a significant impact in a dynamic and rapidly evolving field, with the potential for international relocation.

Competenze

• 15+ years in the semiconductor industry with a focus on eNVM technologies.
• Strong understanding of device physics and analytical techniques.

Mansioni

• Integrate eNVM features into platform technologies and manage projects.
• Lead cross-functional teams and build customer relationships.

Conoscenze

CMOS device physics

eNVM technologies

project management

cross-functional team leadership

problem-solving skills

Formazione

M.S or PhD in Electrical Engineering

M.S or PhD in Materials Science

Descrizione del lavoro

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R&D – Head of Embedded NVM Technologies, Firenze

Client: Theron Solutions

Location: Firenze, Italy

Job Category: Other

EU work permit required: Yes

Job Reference:

428703351644671180833714

Job Views:

2

Posted:

26.04.2025

Expiry Date:

10.06.2025

Job Description:

THIS ROLE REQUIRES A RELOCATION TO DHOLERA, INDIA once the FAB is built.

Responsibilities:

1. Integrate eNVM (embedded Non Volatile Memory) features into 28 110nm platform technologies, including MTP and Flash. Collaborate with IP providers as needed.
2. Design and layout test chips to optimize device/technology, assess reliability, and extract SPICE models.
3. Manage projects from justification to qualification and yield ramp, ensuring performance, quality, schedule, and cost targets are met.
4. Lead a cross-functional team across diverse geographies.
5. Build strong customer relationships based on confidence in the company's technical capabilities.
6. Conduct competitor benchmarking and own the technology roadmap.
7. Present to internal and customer senior executives.
8. Potential involvement in OTP development.
9. Travel a few weeks per quarter.

Qualifications:

1. M.S or PhD in Electrical Engineering, Materials Science, or equivalent.
2. Strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, and analytical techniques.
3. Deep knowledge of key eNVM technologies (charge trap, floating gate, RRAM, MRAM, etc.).
4. Understanding of technology parameters and figures of merit (bit cell size, macro size, endurance, retention, power, latency, mask count, etc.).
5. Proven track record in delivering these technologies into volume manufacturing.
6. Ability to lead cross-functional teams and meet project timelines and budgets.
7. Experience working across cultures and geographies.
8. Strong team player with innovative and competitive mindset.

Desired Experience Level:

1. 15+ years in the semiconductor industry.
2. Successful track record of developing new technologies into high-volume production.
3. Strong problem-solving skills using design of experiments and analytical tools.

EOE:

Our client is an Equal Opportunity Employer committed to a work environment free of discrimination and harassment. Employment decisions are based on business needs, job requirements, and individual qualifications, without regard to protected characteristics.