Process Integrator: Glass Packaging & HVM Transfer

Ephos; Lombardia; On-site; EUR 90,000 - 110,000; Full time

Benefits offered by this job

Stock options

Growth opportunities

Top salary

Job summary

Ephos is building vertically integrated, advanced packaging solutions on glass panels. We seek a Process Integrator to architect end-to-end integration flows for next-generation microelectronics modules, connecting lithography, etching, metallization, and bonding into high-yield manufacturing lines.

You will design project-oriented integration flows, leverage internal R&D tools, and establish external partnerships, with a strong emphasis on transferring mature processes to mass production.

Qualifications

• Master’s or Ph.D. in Materials Science, Electrical Engineering, Physics, Chemical Engineering, Microelectronics, or a related discipline.
• 5+ years of experience in semiconductor integration, advanced packaging development, or specialized glass substrate manufacturing.
• Thorough understanding of state-of-the-art advanced packaging techniques and how to implement them in projects.
• Proven experience defining and executing multi-step fabrication flows from concept to functional devices.
• Experience working with external vendors, consortiums, or foundry partners to run external lots or co-develop process steps.
• Able to commit to full-time lab presence; remote work is not considered.
• Excellent documentation habits and communication skills to translate R&D insights into mass production instructions.

Responsibilities

• Design, develop, and execute end-to-end integration flows for advanced packaging schemes on glass substrates.
• Assess internal R&D tool capabilities and manage external partnerships to complete flows.
• Stay at the forefront of advanced packaging techniques (2.5D/3D, wafer-level, chiplet) and implement them in projects.
• Analyze physical, chemical, and mechanical interactions between process steps to resolve bottlenecks.
• Lead documentation, FMEA, and knowledge transfer of mature R&D flows to high-volume manufacturing facilities.

Skills

Documentation

Communication

Education

Master’s in Materials Science

Ph.D. in Electrical Engineering

Job description

Ephos is building vertically integrated, advanced packaging solutions on glass panels. We seek a Process Integrator to architect end-to-end integration flows for next-generation microelectronics modules, connecting lithography, etching, metallization, and bonding into high-yield manufacturing lines.

You will design project-oriented integration flows, leverage internal R&D tools, and establish external partnerships, with a strong emphasis on transferring mature processes to mass production.