Employment Type : Full-Time
Experience Level : Senior / 15+ Years
Department : Hardware Engineering / Imaging Systems
Job Summary
One of my clients is seeking a highly experienced Principal Hardware Design Engineer to lead the development of advanced PCB systems for day and thermal imaging platforms. This role is critical in delivering high-performance, ruggedized hardware for defense and surveillance applications, with a strong emphasis on signal integrity, environmental resilience, and system integration.
Core Responsibilities
- Lead schematic capture, PCB layout, and SPICE simulation using Altium Designer or similar tools.
- Design and develop PCBs for day and thermal camera systems, including sensor interfaces, power regulation, and digital processing modules.
- Create complex multilayer PCBs with high-speed video data transmission, using techniques such as blind / buried vias, via-in-pad, and BGA configurations.
- Ensure signal integrity and minimize crosstalk through effective analog / digital domain separation.
- Develop ruggedized PCBs for harsh environmental conditions typical in defense and surveillance.
- Design power distribution systems with a focus on low noise, thermal management, and EMC.
- Integrate interface standards such as MIPI CSI, LVDS, HDMI, and USB into camera modules.
- Implement EMI / ESD protection, grounding schemes, and shielding for high-sensitivity imaging systems.
- Generate complete manufacturing documentation including BOMs, Gerber files, assembly drawings, and test plans.
- Collaborate with firmware and optics teams to ensure alignment with calibration, synchronization, and system integration.
- Mentor junior engineers and support peer reviews and validation processes.
- Utilize lab tools (e.g., logic analyzers, oscilloscopes, thermal cameras) for debugging and validation.
Supporting Responsibilities
- Work with microcontroller, FPGA, and ISP architectures for camera control and data handling.
- Support integration of thermal sensors (e.g., ULIS, FLIR) and visible image sensors into embedded systems.
- Apply thermal management techniques and temperature compensation for IR camera hardware.
- Conduct hardware bring-up, calibration board support, and sensor alignment.
- Collaborate with systems engineering and testing teams during lab and field trials.
Required Qualifications
- Bachelor’s or Master’s degree in Electrical or Electronics Engineering.
- 15+ years of experience in hardware design, with a strong focus on imaging systems and PCB development.
- Proven track record of successful PCB designs in defense or ruggedized environments.
- Deep knowledge of Altium Designer and hardware troubleshooting.
Key Skills
- Digital Electronics : Strong foundation in digital circuit design and signal processing.
- High-Speed Data Handling : Experience with high-bandwidth video and data interfaces.
- Thermal & Day Camera Design : Specialized knowledge in imaging hardware for surveillance and defense.
- Altium Designer : Expert-level proficiency in schematic capture, layout, and simulation.
- Defense Industry : Familiarity with ruggedization, MIL-STD compliance, and environmental constraints.