Packing Machinery Engineer

2D Photonics; Pisa; In loco; EUR 60.000 - 90.000; Tempo pieno

Descrizione del lavoro

A leading company in photonic technologies is seeking a Principal Advanced 3D Packaging Engineer to spearhead the development of innovative 3D packaging solutions. This role involves integrating advanced technologies into optical interconnects aimed at generative AI and high bandwidth applications. The ideal candidate will possess over a decade of relevant industry experience, particularly in advanced packaging development and materials science.

Competenze

• 10+ years industry experience in advanced packaging development.
• Proven experience in designing for organic, CoWoS or EMIB substrate technologies.
• Deep understanding of materials science for substrate and interconnect design.

Mansioni

• Drive the design and development of innovative 3D packaging solutions.
• Evaluate and select advanced packaging technologies across integration domains.
• Collaborate with internal teams to co-design packaging solutions.

Conoscenze

Analytical skills

Problem-solving

Communication

Formazione

Bachelor or Master’s in relevant Engineering discipline

Descrizione del lavoro

At 2D Photonics and CamGraPhIC we develop ultra-high bandwidth, low-latency optical interconnects for generative AI, cellular, and high-bandwidth data transfer applications.

The way we incorporate graphene with silicon photonics preserves its unique electro-optical properties and enables a next generation of optical interconnect devices with reduced electronic complexity, improved energy consumption, and higher channel density.

At CamGraPhIC in Pisa, Italy we run the 700 sqm Inphotec Graphene Photonics development facility, where our team of industry-leading scientists, process development and photonics engineers are pioneering the design and fabrication of Photonic Integrated Circuits (PICs) incorporating Graphene.

CamGraPhIC Srl is a wholly owned subsidiary of 2D Photonics SpA

We are seeking a Principal Advanced 3D Packaging Engineer to drive the design and development of innovative 3D packaging solutions for ultra-high bandwidth, low latency optical interconnects targeting generative AI, cellular, and high bandwidth data transfer applications. You will have a proven track record in developing innovative packaging solutions for optical or photonics applications.

Developing and executing strategies to integrate industry-leading advanced packaging technologies into our optical interconnect solutions

Evaluating and selecting Advanced Packaging technologies across 2.5D, 3D and heterogeneous integration domains

Collaborating with internal silicon, photonics, and simulation teams to co-design packaging solutions and seamlessly integrate devices, substrates and interposers

Driving innovation in thermal, power, mechanical and signal integrity simulation and package design

Establishing relationships with foundry partners, OSATs and suppliers to evaluate concepts, develop solutions, and qualify designs

Bachelor or Master’s in relevant Engineering discipline with 10+ years industry experience

Track record in 3D Advanced Package development including proven experience in designing for organic, CoWoS or EMIB substrate technologies

Deep understand of materials science and materials selection for substrate and interconnect design

Track record of taking advanced packaging designs from concept through to qualification and production

Strong analytical and problem-solving skills with a data-driven, detail-oriented approach

Excellent English verbal and written communication skills